Check patentability & draft patents in minutes with Patsnap Eureka AI!

An electronic device and cooling method

A technology of electronic equipment and heat dissipation device, which is applied in the electronic field, can solve the problems of poor heat dissipation effect of electronic equipment, achieve the effects of improving heat dissipation effect, accelerating conduction and emission, and improving heat dissipation capacity

Active Publication Date: 2020-08-25
LENOVO (BEIJING) LTD
View PDF4 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The application provides an electronic device and a heat dissipation method, which are used to solve the technical problem that the heat dissipation effect of the electronic device is poor

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • An electronic device and cooling method
  • An electronic device and cooling method
  • An electronic device and cooling method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0033] Embodiments of the present invention provide an electronic device and a heat dissipation method, which are used to solve the technical problem of poor heat dissipation effect of the electronic device and improve the heat dissipation capability of the electronic device.

[0034] In the embodiment of the present invention, the heat dissipation device includes N fins in contact with at least one heat-generating component in the electronic device, a fan capable of generating wind blowing to the N fins, and a liquid pipe in contact with the fins, so that When at least one heat-generating component generates heat, heat can be absorbed by N fins to dissipate the heat generated by the heat-generating component through fans and / or liquid pipes, and the liquid pipe is connected to the fins, so that the heat-generating components on the fins can be dissipated The heat is conducted away and dissipated. At the same time, the fan can accelerate the conduction and distribution of heat,...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention provides an electronic device and a cooling method. The electronic device and the cooling method are used for solving the technical problem that an electronic device is poor in cooling effect. The electronic device comprises a cooling device. The cooling device comprises N fins, a fan and a liquid pipe, wherein the fins make contact with at least one heating part in the electronic device, N is a positive integer larger than or equal to 2, the fan is used for generating wind blown to the N fins, the liquid pipe makes contact with the N fins, the N fins can absorb heat when at least one heating part generates heat, and heat is dissipated through the fan and / or the liquid pipe.

Description

technical field [0001] The invention relates to the field of electronic technology, in particular to an electronic device and a heat dissipation method. Background technique [0002] With the rapid development of science and technology and the increasingly fierce market competition, the performance and appearance of electronic equipment have been greatly improved. Among them, notebook computers are being loved by more and more people because of their small size, light weight, easy portability, and strong entertainment. , become an indispensable part of learning and life. [0003] At present, in the process of using electronic devices, as the power consumption of electronic devices continues to increase, the heat generated will continue to increase. However, for devices with limited size, such as notebook computers, the traditional fans installed inside can only It can dissipate heat by increasing air convection. The heat dissipation is limited by the thermal conductivity an...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): G06F1/20
CPCG06F1/20G06F2200/201G06F2200/202G06F2200/203
Inventor 杨帆唐波
Owner LENOVO (BEIJING) LTD
Features
  • R&D
  • Intellectual Property
  • Life Sciences
  • Materials
  • Tech Scout
Why Patsnap Eureka
  • Unparalleled Data Quality
  • Higher Quality Content
  • 60% Fewer Hallucinations
Social media
Patsnap Eureka Blog
Learn More