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Material receiving mechanism used for manufacturing semiconductor module and working method of mechanism

A collection mechanism and semiconductor technology, which is used in semiconductor/solid-state device manufacturing, conveyor objects, electrical components, etc., can solve the problem of inability to ensure long-term efficient and stable operation, complicated operation process of the collection mechanism, and high manufacturing and operating costs. and other problems, to achieve the effect of low operating costs, low manufacturing and operating costs, and smooth and efficient operation.

Inactive Publication Date: 2016-11-30
TAICANG GAOCHUANG ELECTRICAL TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] 1. The overall structure and operation process of the receiving mechanism are very complicated, and the load requirements are high, the maintenance is very cumbersome, and the manufacturing and operating costs are high;
[0005] 2. The degree of automation is low, the operation of personnel is complicated, and the efficiency of receiving materials is low;
[0006] 3. Deviations and failures are prone to occur during operation, and long-term efficient and stable operation cannot be guaranteed

Method used

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  • Material receiving mechanism used for manufacturing semiconductor module and working method of mechanism

Examples

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Comparison scheme
Effect test

Embodiment 1

[0028] Such as figure 1 As shown, a material receiving mechanism for manufacturing semiconductor modules in this embodiment includes: a linear module 1, a suction nozzle 2, a suction nozzle cylinder 3, a material receiving track 4, a material receiving tube 5, a push tube cylinder 6, Material tube push block 7, push plate 8, push material cylinder 9 and material receiving bucket 10.

[0029] The connection relationship of the above-mentioned components is as follows: one end of the linear module 1 is connected with a suction nozzle 2, and the two ends of the receiving track 4 are respectively connected with the linear module 1 and the receiving pipe 5; one side of the receiving track 4 A push plate 8 and a material pushing cylinder 9 are connected in sequence, and a material tube push block 7 and a material receiving barrel 10 are respectively arranged on both sides of the material receiving tube 5 . Wherein the suction nozzle 2 is driven by the suction nozzle cylinder 3 conn...

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PUM

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Abstract

The invention discloses a material receiving mechanism for manufacturing semiconductor modules, which mainly relates to the technical field of semiconductor manufacturing, including a linear module, a suction nozzle, a material receiving track, a material receiving pipe, a material pipe pushing block, a pushing plate, a pushing material cylinder and material receiving barrel; one end of the linear module is connected with a suction nozzle, and the two ends of the material receiving track are respectively connected with the linear module and the material receiving pipe; one side of the material receiving track is sequentially connected with a push plate and a push material cylinder, the two sides of the material receiving pipe are respectively provided with a material pipe push block and a material receiving barrel; the overall structure and operation process of the material receiving mechanism of the present invention are very simple, the maintenance is convenient and fast, the cost is low, and its degree of automation is high. The operation is simple and can ensure long-term efficient and stable operation. The invention also discloses a working method of a material receiving mechanism for manufacturing semiconductor modules.

Description

technical field [0001] The invention relates to the technical field of semiconductor manufacturing, in particular to a material receiving mechanism for manufacturing semiconductor modules and a working method of the material receiving mechanism. Background technique [0002] The semiconductor module is a device that produces stimulated emission by using a certain semiconductor material as a working substance, and is a part of the semiconductor laser. [0003] In recent years, with the continuous development of science and technology, related industries have higher and higher technical requirements for semiconductor modules. However, the existing receiving mechanism for manufacturing semiconductor modules still has the following defects: [0004] 1. The overall structure and operation process of the receiving mechanism are very complicated, and the load requirements are high, the maintenance is very cumbersome, and the manufacturing and operating costs are high; [0005] 2...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/677H01L21/683
CPCH01L21/67736H01L21/6838
Inventor 程嘉义
Owner TAICANG GAOCHUANG ELECTRICAL TECH
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