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Grinding Wheel Design with Elongated Teeth Arrangement

A grinding wheel and elongated technology, which is applied in the direction of the wheel, grinding device, grinding machine tool, etc. of the working part with flexibility, and can solve problems such as inaccurate detection methods and loss of yield

Inactive Publication Date: 2016-12-07
TAIWAN SEMICON MFG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, this detection method is inaccurate and can lead to yield loss

Method used

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  • Grinding Wheel Design with Elongated Teeth Arrangement
  • Grinding Wheel Design with Elongated Teeth Arrangement
  • Grinding Wheel Design with Elongated Teeth Arrangement

Examples

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Embodiment Construction

[0061] The following disclosure provides a number of different embodiments or examples for implementing different features of the present invention. Specific examples of components and arrangements are described below to simplify the present disclosure. Of course, these are only examples and are not intended to limit the invention. For example, in the following description, forming a first component over or on a second component may include embodiments in which the first component and the second component are in direct contact, and may also include that other components may be formed between the first component and the second component An embodiment such that the first part and the second part are not in direct contact. Additionally, the present invention may repeat reference symbols and / or characters in multiple instances. This repetition is for simplicity and clarity, and does not in itself indicate a relationship between the various embodiments and / or configurations descr...

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Abstract

A grinding wheel includes a base disk, and a plurality of teeth protruding beyond a surface of the base disk. The plurality of teeth is aligned to an elongated ring encircling a center of the grinding wheel.

Description

[0001] Cross References to Related Applications [0002] This application is a continuation-in-part of commonly assigned patent application Ser. No. 13 / 290,879, filed November 7, 2011, entitled "End Point Detection in Grinding," the entire contents of which are hereby incorporated by reference. technical field [0003] The present invention relates to a grinding wheel design with an elongated tooth arrangement. Background technique [0004] Lapping is a commonly used technique in the manufacture of integrated circuits. During the grinding process, a grinding wheel is placed over the wafer. Both the grinding wheel and the wafer rotate, thus reducing the thickness of the wafer as the grinding wheel removes the surface layer. [0005] In the fabrication of device wafers, grinding can be used, for example, in backside thinning of silicon substrates during the formation of through-silicon vias (TSVs). There are other processes that may use milling techniques. In the formation...

Claims

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Application Information

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IPC IPC(8): B24B37/10B24B37/34B24D13/14
CPCB24B37/107B24B37/34B24D13/145
Inventor 苏峻兴林俊成符策忠张文华茅一超
Owner TAIWAN SEMICON MFG CO LTD