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A kind of reverse conduction igbt

A reverse-conducting, N-type technology, applied in the field of power semiconductor devices, to eliminate the negative resistance effect and improve the forward and reverse conduction performance.

Active Publication Date: 2019-08-23
UNIV OF ELECTRONICS SCI & TECH OF CHINA
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Due to the conversion from MOSFET mode to IGBT mode, the output characteristic curve of the traditional reverse conduction IGBT has a negative resistance effect (also known as voltage bounce phenomenon), as shown in the attached manual image 3 shown

Method used

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  • A kind of reverse conduction igbt
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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0019] Example 1, such as Figure 4 As shown, this example is a trench gate reverse conduction IGBT. P-type regions 1 are formed on the surface of the N-type high-resistance semiconductor material, and N-type emitter regions 3 and P-type body contact regions 4 are alternately formed on the surface of the P-type regions along the lateral direction of the device. In the middle of the N-type emitter region 3, a dielectric groove 2 is formed that runs through the P-type region and is in contact with the N-type high-resistance semiconductor at the bottom. The dielectric groove is composed of an insulating dielectric layer 21 located on the inner wall of the groove and a conductive material 22 surrounded by the insulating dielectric layer. The gate electrode is led out from the conductive material in the dielectric groove to form a groove gate structure; the common leading end of the N-type emitter region and the P-type body contact region is the emitter electrode. On the back of t...

Embodiment 2

[0023] Such as Figure 5 As shown, this example is a trench gate reverse conduction IGBT. The difference between this example and Example 1 is that the widths of the heavily doped N-type regions in the electric field stop region 6 along the lateral direction of the device are equal, and the lightly doped P-type regions in the electric field stop region 6 The width along the lateral direction of the device is not equal (ΔL 1 , ΔL 2 , ΔL 3 , ΔL 4 , ΔL 5 ).

Embodiment 3

[0025] Such as Figure 6 As shown, this example is a planar gate reverse conduction IGBT. Several P-type well regions 1 are formed on the surface of the N-type high-resistance semiconductor material, and an N-type emitter region 3 and a P-type body contact region 4 are formed side by side on the surface of the P-type well region along the device lateral direction, and the N-type emitter region is close to the P-type well The P-type body contact region is far away from the edge of the P-type well region, and the common lead end of the two is the emitter electrode, and the N-type emitter region has a distance from the edge of the P-type well region. The semiconductor surface between two adjacent N-type emitter regions 3 in two adjacent P-type well regions is covered with a gate dielectric, and the surface of the gate dielectric is covered with conductive material to form a planar gate structure, and a gate electrode is drawn out. On the back of the N-type high-resistance semico...

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PUM

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Abstract

The invention belongs to the technical field of power semiconductor devices, and relates to a reverse conduction IGBT. The technical proposal of the reverse conduction IGBT of the present invention is: forming P-type regions on the surface of the N-type high-resistance semiconductor material, and forming N-type emitter regions and P-type body contact regions side by side and alternately on the surface of the P-type regions. In the middle of the N-type emitter region, a dielectric groove that runs through the P-type region and is in contact with the N-type high-resistance semiconductor at the bottom is formed, and the gate electrode is drawn out from the conductive material in the dielectric groove to form a groove gate structure; the N-type emitter region and the P-type The common terminal of the body contact area is the emitter electrode. On the back of the N-type high-resistance semiconductor material, a collector region is formed by continuously alternating N-type regions and P-type regions, and the common lead-out end of the N-type and P-type regions is a collector. The top of the collector region introduces an electric field stop region, and there is a distance between the electric field stop region and the collector region in the longitudinal direction of the device, and the electric field stop region consists of heavily doped N-type regions and lightly doped Mixed P-type region composition.

Description

technical field [0001] The invention belongs to the technical field of power semiconductor devices, and relates to a reverse conduction type IGBT (insulated gate bipolar transistor). Background technique [0002] The reverse conduction IGBT was first proposed by Hideki Takahashi in the document "1200V Reverse Conducting IGBT" (04'ISPSD). figure 1 shown). The advantage of the reverse conduction IGBT is that it can effectively avoid the parasitic effect of the traditional IGBT and diode in the packaging process, and reduce the manufacturing cost. The general practice of reverse conduction IGBT is to replace part of the P-type collector area of ​​the traditional IGBT with the N-type collector area, as shown in the attached manual figure 2 shown. For the manual attached figure 2 In the reverse conduction IGBT shown, in the early stage of forward conduction of the device, the current flowing through the drift region is the electron current, and the electron current is colle...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L29/06H01L29/739
CPCH01L29/0615H01L29/7393H01L29/0634H01L29/0834H01L29/7397H01L29/0804H01L29/1095H01L29/7395H01L29/7416H01L29/8611
Inventor 罗小蓉邓高强周坤刘庆黄琳华孙涛张波
Owner UNIV OF ELECTRONICS SCI & TECH OF CHINA
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