A kind of low temperature curing epoxy resin adhesive and preparation method thereof
A technology for curing epoxy resin and epoxy resin, which is applied in the direction of epoxy resin glue, adhesives, adhesive additives, etc. It can solve the problems of affecting production efficiency, long curing time, and long time required for complete curing, so as to improve production capacity and work efficiency, solve the problem of not being able to bake at high temperature or for a long time, reduce energy costs and energy consumption
Active Publication Date: 2019-07-16
东莞市新懿电子材料技术有限公司
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Problems solved by technology
[0003] The curing temperature of the existing epoxy resin-based adhesives is mostly between 100-150°C, or two-component curing at room temperature, both of which have disadvantages
The former has a higher curing temperature or too long curing time, which is inconvenient and risky in the production and construction process, and is easy to damage the pasted components, resulting in high component loss and high energy consumption costs; the latter takes time to fully cure under normal temperature conditions Too long and the structural strength of the epoxy resin-based adhesive is not fully reflected, directly affecting production efficiency
Method used
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Embodiment 1～3
[0030] Prepare low-temperature curing epoxy resin adhesive, the specific components and contents are shown in Table 1, and the preparation method is as follows:
[0031] Step 1: Take bisphenol F epoxy resin and bisphenol A epoxy resin in the circulating cooling equipment, directly add calcium carbonate powder, toner and thixotropic agent to it, and carry out high-speed stirring. During this process, the circulating cooling equipment The temperature is controlled within the range of 20-25°C, and the stirring is continued for 80-120 minutes;
[0032] Step 2: Cool the result of Step 1 to room temperature, add amine curing agent and organic urea accelerator to it and stir at a low speed to disperse it. During this process, control the temperature of the circulating cooling equipment within the range of 20-25°C and keep stirring 20-30 minutes;
[0033] Step 3: Add polythiol accelerator and diluent to the obtained step 2, and stir at a low speed. During the process, control the tem...
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The invention belongs to the technical field of adhesives and in particular relates to a low-temperature curing epoxy resin adhesive. The adhesive is prepared from the following components by weight percent: 25-40% of bisphenol F epoxy resin, 15-25% of bisphenol A epoxy resin, 10-20% of amine curing agent, 10-20% of polythiol accelerator, 4-10% of thixotropic agents, 10-20% of calcium carbonate powder and 0.1-1% of toner, wherein the amine curing agent is dicyandiamide (DICY); the polythiol accelerator is 3-mercaptopropionate (TMPMP). Besides, the invention also provides a preparation method of the low-temperature curing epoxy resin adhesive. Compared with the prior art, the adhesive and the preparation method have the beneficial effects that the components promote each other and jointly cooperate by reasonably controlling the contents of the components, so that the curing temperature of the epoxy resin adhesive is obviously reduced and the curing time is greatly shortened, thus solving the problems that components and parts can not be roasted at high temperature or for a long time in practical application, improving the capacity and the work efficiency and reducing the energy cost and energy consumption.
Description
technical field [0001] The invention belongs to the technical field of adhesives, in particular to a low-temperature curing epoxy resin adhesive and a preparation method thereof. Background technique [0002] Epoxy resin-based adhesives have excellent properties such as bonding strength, corrosion resistance, electrical insulation, and high strength, and are widely used in the fields of electronics, machinery manufacturing, and chemical anticorrosion. After the cross-linking reaction between the epoxy resin and the curing agent, the two-dimensional structure becomes a three-dimensional structure, and its excellent performance is reflected. The curing agents commonly used for epoxy resins include acid anhydrides, amines and synthetic resins. [0003] The curing temperature of existing epoxy resin-based adhesives is mostly between 100-150°C, or two-component curing at room temperature, both of which have disadvantages. The former has higher curing temperature or too long cur...
Claims
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IPC IPC(8): C09J163/00C09J11/04C09J11/06C09J11/08
CPCC08L2205/025C08L2205/03C09J11/04C09J11/06C09J11/08C09J163/00C08L63/00C08K13/02C08K2003/265C08K5/37C08K3/36
Inventor 黄剑滨黄伟希刘准亮莫如栩黄秀花黎红燕
Owner 东莞市新懿电子材料技术有限公司