High rupture resistant rigid-flex printed circuit board (PCB)

Abstract

The invention relates to a high rupture resistant rigid-flex printed circuit board (PCB). The high rupture resistant rigid-flex printed circuit board is characterized in that an interlayer of the rigid-flex printed circuit board is a polyimide layer, a PCB rigid board portion is arranged on the inner side of the polyimide layer, and a FPC (flexible printed circuit) flexible board portion is arranged on the outer side of the polyimide layer; an L2 circuit board, an upper cover membrane, an upper layer prepreg, an upper FR4 layer, an L1 circuit board and an upper resistance welding layer are sequentially overlapped on the upper surface of the interlayer from bottom to top; an L3 circuit board, a lower cover membrane, an lower layer prepreg, a lower FR4 layer, an L4 circuit board and a lower resistance welding layer are sequentially overlapped on the lower surface of the interlayer; the upper FR4 extends outwards 0.2mm relative to the upper layer prepreg, the lower FR4 layer extends outwards 0.2mm relative to the lower layer prepreg, a concave is formed in the rigid-flex junction, rigid-flex combination is removed, and the number of bending times is increased.

Description

technical field [0001] The invention relates to a rigid-flex board, in particular to a rigid-flex board with high bending resistance. Background technique [0002] With the vigorous development of mobile phone fingerprint identification, the fingerprint module carrier board requires products with small size, high heat resistance, superior bending performance and multi-functional rigid-flex printed circuit boards to be used more and more. However, the existing four-layer rigid-flex composite plate combined with 1-2-1 structure cannot meet the demand for more than 100,000 bending times. In order to meet the requirements of the number of bending times, the method of dispensing glue at the rigid-flex joint is now used to eliminate the stress during bending, but the workload of dispensing is large and the production efficiency is low. At the same time, dispensing is also prone to excessive dispensing or insufficient dispensing, resulting in scrap. Contents of the invention [...

AI Technical Summary

Problems solved by technology

However, the existing four-layer rigid-flex combined plate combined with 1-2-1 structure cannot meet the needs of more than 100,000 bending times

In order to meet the requirements of the number of bending times, the method of dispensing glue at the rigid-flexible joint is now used to eliminate the stress during bending, but the workload of dispensing is large and the production efficiency is low. At the same time, dispensing is also prone to excessive dispensing or insufficient dispensing, resulting in scrap

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