Manufacturing method of metal wire for flexible substrate

A technology of metal wires and flexible substrates, applied in semiconductor/solid-state device manufacturing, semiconductor devices, semiconductor/solid-state device components, etc., can solve problems such as easy fracture, achieve stress release, simple and feasible process steps, and improve bending resistance and reliability effects

Active Publication Date: 2018-12-07
CHENGDU VISTAR OPTEOLECTRONICS CO LTD
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  • Abstract
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  • Claims
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Problems solved by technology

[0004] However, due to the limitation of the fatigue strength of the metal wires, the metal wires are easy to break after bending the flexible substrate many times

Method used

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  • Manufacturing method of metal wire for flexible substrate
  • Manufacturing method of metal wire for flexible substrate
  • Manufacturing method of metal wire for flexible substrate

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Embodiment Construction

[0022] In order to further illustrate the technical means and functions adopted by the present invention to achieve the intended purpose of the invention, the present invention will be described in detail below in conjunction with the accompanying drawings and preferred embodiments.

[0023] Such as figure 1 As shown, the metal wire manufacturing method of the flexible substrate of the present invention includes:

[0024] Step 1: preparing a polyimide solution 20 containing air bubbles 21;

[0025] Step 2: Coating the polyimide solution 20 containing bubbles 21 on a substrate 10 (such as figure 2 shown);

[0026] Step 3: Baking and curing the polyimide solution 20. During the baking and curing process, the bubbles 21 gradually gather to the surface layer of the polyimide solution 20 and burst, forming a substrate with multiple concave holes on the surface. polyimide layer 20';

[0027] Step 4: Deposit metal layer 30 (such as image 3 shown);

[0028] Step 5: patterning ...

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Abstract

The invention provides a metal wire manufacturing method of a flexible substrate. The method comprises a step of preparing a polyimide solution containing bubbles, a step of coating a substrate with the polyimide solution containing bubbles, a step of carrying out baking-curing and forming a polyimide layer with concave holes on the substrate, a step of depositing a metal layer on the polyimide layer, and a step of patterning the metal layer and forming wavy metal wires on the polyimide layer. According to the method, through simple steps, the wavy metal wires are formed on the substrate, the formed metal wires can release the stress of the formed metal wires in the bending of the flexible substrate, and the bending resistance and reliability of the flexible substrate are improved.

Description

technical field [0001] The invention relates to the technical field of flexible display, in particular to a method for manufacturing a metal wire of a flexible substrate. Background technique [0002] Flexible displays are widely used in electronic devices such as e-books, dashboards, mobile phones, and tablet computers due to their advantages such as lightness, softness, low power consumption, excellent display effects, and easy installation. [0003] The biggest feature of flexible displays is that they can be bent. Usually, there are metal wires on the flexible substrate. Good display. [0004] However, due to the limitation of the fatigue strength of the metal wires, the metal wires are easily broken after being bent many times by the flexible substrate. Contents of the invention [0005] In view of this, the present invention provides a metal wire manufacturing method of a flexible substrate. [0006] The metal lead wire manufacturing method of the flexible substra...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/48H01L23/498
Inventor 于锋朱涛葛泳唐静袁春芳
Owner CHENGDU VISTAR OPTEOLECTRONICS CO LTD
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