Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Reliable and efficient carrying mechanical arm used for wafer cassette

A technology of manipulators and wafer boxes, applied in the direction of manipulators, program-controlled manipulators, chucks, etc., can solve the problems of overturning wafer boxes, seldom mentioning, and breaking wafers, so as to ensure safety and improve work Efficiency and reliability, effects of eliminating the influence of positional deviation

Active Publication Date: 2017-02-15
SUZHOU XINYOUHUA INVESTMENT ADVISOR CO LTD
View PDF7 Cites 4 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

If the wafer box deviates from the spatial positioning point when the manipulator at the end of the robot arm grabs it, the manipulator is very likely to grab empty or even directly hit the non-grabbing point on the wafer box, causing the wafer box to fall or break. Phenomena such as wafers
In addition, during the handling process of the robot arm, due to the low friction coefficient of the wafer box material, it is also very easy to cause the wafer box to slip from the manipulator due to unreliable grasping
The above-mentioned phenomenon often occurs in today's semiconductor field by using robotic arms to carry wafer boxes, and the solution to this problem is rarely mentioned in existing patents in related fields

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Reliable and efficient carrying mechanical arm used for wafer cassette
  • Reliable and efficient carrying mechanical arm used for wafer cassette
  • Reliable and efficient carrying mechanical arm used for wafer cassette

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0043] see Figure 1 to Figure 9 , as shown in the legend, a manipulator for reliable and efficient handling of wafer boxes. Wafer box A is positioned on the stage, and manipulator B is driven by robotic arm C to grab and transport wafer box A.

[0044] The wafer box A includes a box body 11 and a handle 12 , the handle 12 is generally U-shaped when viewed from above, and the two free ends of the handle 12 are respectively connected to the outer surfaces of the box body 11 .

[0045] Manipulator B includes:

[0046] The mounting plate 21 is connected to the end of the mechanical arm C;

[0047] The hand claw 31 is generally J-shaped in side view, and the upper end of the non-hook part of the hand claw 31 is connected to the mounting plate 21;

[0048] Visual sensor 41, the visual sensor 41 is arranged on the non-hook side of the gripper 31 and communicates with the transport controller, the visual sensor 41 is assembled on the mounting plate 21, and the transport controller ...

Embodiment approach

[0053] In one embodiment:

[0054] The non-hook part of the gripper 31 is provided with a release groove 32 penetrating to the free end of the hook of the gripper 31, and the two groove walls at the lower port of the release groove 32 are generally in a figure-eight shape in front view. Two guide slopes 33 are respectively processed on the opposite surface of the free end of the crotch hook of the claw 31 and the non-crotch part of the claw opposite thereto.

[0055] The contact part with the wafer box is required to be polished smoothly, so if there is not an obvious positional deviation between the grabbing point of the wafer box and the positioning point of the robot arm, it can guide the claws to smoothly insert into the slot of the wafer box handle inward and hook the outer edge of the handle.

[0056] In one embodiment:

[0057] The locking driving unit includes a motor 531 and a reducer 532. The motor 531 is provided with an encoder 533 and its output end is connected...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a reliable and efficient carrying mechanical arm used for a wafer cassette. The wafer cassette comprises a cassette body and a handle, the handle is roughly in a U shape in an overlooked manner, the mechanical arm comprises a paw, a positioning sensor and a locking mechanism, the paw is roughly in a J shape in a side-looking manner, the positioning sensor is arranged on the side of a non-bending hook of the paw and is communicated with a carrying controller, the locking mechanism comprises a locking block, a locking drive unit and a locking controller, the locking block is arranged on one side of a bending hook of the paw, the locking drive unit drives the locking block to vertically move, and the locking block ascends to enable the lower end of the locking block to be away from the bending hook free end of the paw or descends to enable the lower end of the locking block to abut against the bending hook free end of the paw. The mechanical arm is small in size and compact in structure and has the vision identifying and sensing detection function, and a material locking mechanism is arranged on a mechanical structure. It is ensured that the mechanical arm can accurately and reliably grab the wafer cassette, in the carrying process, the wafer cassette can be prevented from sliding off, and efficient and reliable work is achieved.

Description

technical field [0001] The invention relates to the field of test and measurement, in particular to an in-situ calibration device and method for a sensor. Background technique [0002] In the semiconductor industry, the processing and manufacturing of integrated circuits is inseparable from the use of a large number of wafers, and the design and processing of all integrated circuits need to be integrated on wafers. Wafers are very thin, usually only a few tenths of a millimeter, and are brittle. A slight mishandling may directly lead to wafer damage and scrapping. On the other hand, considering the complicated preparation process and high price of wafers, wafers The safety and reliability of the preparation and transportation of semiconductors have always been the focus of the major semiconductor industries. In the process of wafer preparation, it needs to participate in many different processes to obtain the final product. When it is transferred between different processes...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): B25J9/16B25J13/08B25J15/08
CPCB25J9/1679B25J13/088B25J15/083
Inventor 叶磊戴军王宏军林睿厉茂海
Owner SUZHOU XINYOUHUA INVESTMENT ADVISOR CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products