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A kind of aluminum matrix filled thermal interface composite material and its preparation method and application

A composite material and thermal interface technology, applied in the direction of heat exchange materials, chemical instruments and methods, etc., can solve the problem of low thermal conductivity, achieve high thermal conductivity, simple preparation method, and high pressure resistance

Active Publication Date: 2018-11-20
SHENZHEN INST OF ADVANCED TECH CHINESE ACAD OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, alumina is often used as a filler in the market and directly filled into polymers as a thermal interface material. Although the material has good pressure resistance, the thermal conductivity of this type of material is low.

Method used

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  • A kind of aluminum matrix filled thermal interface composite material and its preparation method and application

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Experimental program
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Effect test

Embodiment 1

[0048] This embodiment provides an aluminum-based filled thermal interface composite material. Based on the total weight of the thermal interface composite material as 100%, it consists of the following components in mass percentages: aluminum-based thermally conductive filler (aluminum oxide coated Aluminum powder particle filler) 50%, epoxy resin 25%, curing agent 24%, accelerator 1.0%.

[0049] Wherein, based on the total weight of the alumina-coated aluminum powder particle filler as 100%, the mass percentage of the alumina layer on the surface of the aluminum-based thermally conductive filler is about 20%, and the thickness is not greater than 20nm;

[0050] Described epoxy resin is epoxy 828;

[0051] The curing agent is a mixture of methylhexahydrophthalic anhydride (MHHPA) and methyltetrahydrophthalic anhydride (MTHPA), and the mass ratio of methylhexahydrophthalic anhydride (MHHPA) to methyltetrahydrophthalic anhydride (MTHPA) is 2 :1;

[0052] The accelerator is 2-...

Embodiment 2

[0058] This embodiment provides an aluminum-based filled thermal interface composite material. Based on the total weight of the thermal interface composite material as 100%, it consists of the following components in mass percentages: aluminum-based thermally conductive filler (aluminum oxide coated Aluminum powder particle filler) 60%, epoxy resin 20%, curing agent 19%, accelerator 1.0%.

[0059] Wherein, the alumina layer on the surface of the aluminum-based thermally conductive filler (aluminum oxide-coated aluminum powder particle filler) has a mass percentage of about 30% and a thickness of no more than 20 nm;

[0060] Described epoxy resin is brominated epoxy resin 450A80;

[0061] Described curing agent is the mixture of methylnadic anhydride (MNA) and trimellitic anhydride (TMA), and the mass ratio of described methylnadic anhydride (MNA), trimellitic anhydride (TMA) is 2:1 ;

[0062] The accelerator is a mixture of 2-ethyl-4-methylimidazole and 2-benzyl-4-methylimid...

Embodiment 3

[0068] This embodiment provides an aluminum-based filled thermal interface composite material. Based on the total weight of the thermal interface composite material as 100%, it consists of the following components in mass percentages: aluminum-based thermally conductive filler (aluminum oxide coated Aluminum powder particle filler) 70%, epoxy resin 15%, curing agent 14%, accelerator 1.0%.

[0069] Wherein, the mass percentage of the aluminum oxide layer on the surface of the aluminum-based thermally conductive filler is about 40%, and the thickness is not greater than 25nm;

[0070] Described epoxy resin is novolak type epoxy resin F50;

[0071] Described solidifying agent is the mixture of tung oil anhydride (TOA) and phthalic anhydride (PA), and the mass ratio of described tung oil anhydride (TOA), phthalic anhydride (PA) is 1:1;

[0072] The accelerator is 2,4,6-tris(dimethylaminomethyl)phenol (DMP-30).

[0073] This embodiment also provides a method for preparing the abo...

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Abstract

The invention provides an aluminum-based filling heat interface composite material and a preparation method and application thereof. The aluminum-based filling heat interface composite material is prepared from the following raw materials of 10 to 70 percent of epoxy resin matrix and 30 to 90 percent of heat conduction filler, wherein the total weight of raw materials is 100%. The invention also provides the preparation method of the aluminum-based filling heat interface composite material and the application in heat radiation of electronic components. The aluminum-based filling heat interface composite material has the advantages that an involved technological process and operation are very simple and convenient, the production efficiency is high, and the investment cost of equipment is low; the higher heat conductivity and pressure-withstanding property are realized, an air gap between heat interfaces can be effectively filled, the heat radiating property of the interfaces is greatly improved, and the aluminum-based filling heat interface composite material is an excellent heat interface material.

Description

technical field [0001] The invention relates to an aluminum-based filled thermal interface composite material, a preparation method and application thereof, and belongs to the technical field of thermal interface materials. Background technique [0002] There are many concave and convex pores between the two surfaces of the electronic device and the heat sink. It is precisely because of the existence of these pores that the actual mechanical contact area of ​​the solid interface between the electronic device and the heat sink is very small, and most of the solid surface is separated by air. However, the thermal conductivity of air is very small (about 0.024W / (m·K)), so the large amount of heat generated by the integrated circuit cannot be dissipated in time and effectively through the two solid interfaces, which will cause a large increase in temperature. [0003] In recent years, with the miniaturization of electronic devices and the increasing integration of electronic ch...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08L63/00C08K9/10C08K3/08C08G59/42C09K5/14
CPCC08G59/4238C08K3/08C08K9/10C08K2003/0812C09K5/14C08L63/00
Inventor 符显珠毛大厦孙蓉
Owner SHENZHEN INST OF ADVANCED TECH CHINESE ACAD OF SCI