Layered interface rebuilding method based on electricity/ultrasonic bimodal fusion

A dual-mode, interface technology, which is applied in material analysis using sound waves/ultrasonic waves/infrasonic waves, scientific instruments, and material analysis through electromagnetic means, and can solve problems such as poor detection accuracy of layered interfaces

Active Publication Date: 2017-02-22
TIANJIN UNIV
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Problems solved by technology

[0006] Aiming at the problem of poor detection accuracy of layered interface by single-mode tomographic imaging technology, the present invention proposes a layered interface reconstruction method based on electrical / ultrasonic dual-mode fusion imaging technology

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  • Layered interface rebuilding method based on electricity/ultrasonic bimodal fusion
  • Layered interface rebuilding method based on electricity/ultrasonic bimodal fusion
  • Layered interface rebuilding method based on electricity/ultrasonic bimodal fusion

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Embodiment Construction

[0025] The implementation steps of the method involved in the present invention are described in detail below, which is intended to be described as an embodiment of the present invention, and is not the only form of implementation of the present invention. Other embodiments that can achieve the same structure and function should also be included in the scope of the present invention Inside.

[0026] The invention adopts the principle of ultrasonic testing to obtain the position information of the target interface at a specific point, and uses the information as prior information to constrain the solution process of the electrical imaging problem, so as to improve the underdetermination of the electrical imaging problem and improve the reconstruction accuracy of the layered interface the goal of. The electrical imaging modalities involved may be ERT, ECT, EIT, EMT; the ultrasonic imaging modalities involved may be UTT and URT. The position information at the fixed point of the...

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Abstract

The invention relates to a layered interface rebuilding method based on electricity/ultrasonic bimodal fusion. The layered interface rebuilding method includes the steps that a horizontal center plane of a pipe is defined as a reference plane, a set of forward-direction control points are selected on a target interface, and the distance from the forward-direction control points to the reference plane is recorded as forward-direction distance; the center forward-direction distance dc obtained through ultrasonic serves as the constraint condition of an electricity imaging objective function, and the constrained least-squares problems are built; electricity imaging objective functions with apriori constraints are solved with the shape rebuilding algorithm, and the optimum solution of shape parameters is obtained; the obtained shape parameters are converted into the corresponding target interface with shape functions, and the geometric silhouette of the target interface is drawn. The layered interface rebuilding method has the advantages of being high in rebuilding accuracy.

Description

technical field [0001] The invention belongs to the technical field of electrical / ultrasonic dual-mode fusion imaging, and relates to a layered interface nondestructive testing method. Background technique [0002] The problem of layered interface detection in containers or pipes widely exists in industrial production processes, and accurate reconstruction of layered interface profiles is of great significance for ensuring the safety of industrial production processes and improving production efficiency. Electrical Tomography (ET for short), including: Electrical Resistance Tomography (ERT for short), Electrical Capacitance Tomography (ECT for short), Electrical Impedance Tomography (Electrical Impedance Tomography, EIT for short) and Electromagnetic Tomography (EMT for short) are a kind of process visualization online monitoring technology with the characteristics of non-invasive or non-disturbance. It applies an electrical excitation signal to the target object field thro...

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01N27/00G01N29/024
CPCG01N27/00G01N29/024G01N2291/011G01N2291/0222
Inventor 任尚杰梁光辉董峰
Owner TIANJIN UNIV
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