A method and device capable of self-calibrating microwave performance of multilayer circuit boards

Abstract

The invention relates to the microwave performance testing field of the circuit board and provides a method and apparatus for realizing self-calibration of the microwave performance of a multi-layer circuit board, thereby solving problems in the prior art. Using the method and apparatus provided by the invention, the joint losses, assembling influence, and circuit mismatching influence due to an external testing clamp can be eliminated and thus accurate circuit board testing data can be obtained, thereby serving for simulation parameter correction and simulation precision improvement. According to the method, on the basis of a channel A1, n-1 equations of A2 to An are designed; when the total insertion loss Ki is obtained by a channel Ai, at least one of coefficients of four parameters (B, T, R, and D) changes by being compared with coefficients of corresponding four parameters in the total insertion loss K1 of the channel A1, wherein the i of the Ai is equal to 2 to n and the i of the Ki is equal to 2 to n; and the coefficients of the four parameters (B, T, R, and D) have changed at least one time by corresponding the coefficients of the A1.

Description

technical field [0001] The invention relates to the field of microwave performance testing of circuit boards, in particular to a method and device capable of realizing self-calibration of microwave performance of multilayer circuit boards. Background technique [0002] The characteristics of the substrate material of the circuit board are the reference factors required for designing microwave circuits. According to the dielectric constant and dissipation factor of the substrate material, microwave engineers can calculate the line width of the required circuit and the electrical characteristic parameters of the design pattern through professional simulation software ( Refer to two books: 1) "Detailed Application of HFSS Electromagnetic Simulation Design" written by Li Mingyang. People's Posts and Telecommunications Press, 2011.pp.173-194; 2) "ADS2008 RF Circuit Design and Simulation Examples": edited by Xu Xingfu. Electronic Industry Press, 2009.pp.95-97). However, measuring...

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Problems solved by technology

[0007] 1. There are two different states when the connector is assembled with the circuit board and not assembled with the circuit board, that is, the assembly loss of the connector is not included in this calibration method;

[0008] 2. The impedance matching degree of the circuit and the connector will also bring about the change of the loss, and this information is not included in the calibration

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