Middle-frame structure with thermal insulation and electronic device

Abstract

The present invention provides a middle-frame structure with thermal insulation and an electronic device. The middle-frame structure comprises a body and a frame unit, a thermal insulation layer is formed between the body and the frame unit and is at least arranged at the opposite sides of the body, the thermal insulation layer has a first side connected with the body and a second side connected with a frame unit, and the thermal insulation layer is configured to obstruct the heat of the body to be transmitted to the frame unit.

Description

[0001] 【Technical field】 [0002] The invention relates to the field of portable electronic equipment, in particular to a heat-insulating middle frame structure and electronic equipment. [0003] 【Background technique】 [0004] At present, the size of smart personal electronic devices such as mobile phones, tablet computers or portable readers is getting bigger and thinner, which makes the heat dissipation performance of electronic devices worse and worse. However, most of the heat generated in electronic devices comes from various Generated by the operation of functional units, such as the operation of central processing units (especially the configuration of multi-core computing units for the improvement of execution speed, which will worsen the heat dissipation problem of terminal equipment), batteries, power converters, display screens and other units Both will lead to increased or exacerbated heat generation of electronic equipment. At present, the heat source of most ele...

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Problems solved by technology

[0004] At present, the size of smart personal electronic devices such as mobile phones, tablet computers or portable readers is getting bigger and thinner, which makes the heat dissipation performance of electronic devices worse and worse. However, most of the heat generated in electronic devices comes from various Generated by the operation of functional units, such as the operation of central processing units (especially the configuration of multi-core computing units for the improvement of execution speed, which will worsen the heat dissipation problem of terminal equipment), batteries, power converters, display screens and other units Both will cause the heat generation of electronic equipment to increase or aggravate

At present, the heat source of most electronic equipment is fixed on the middle frame structure of the electronic equipment, so the middle frame first absorbs the heat generated by the execution of each functional unit, so after the electronic equipment is turned on, the temperature of the middle frame is very easy to rise, resulting in The temperature of the body and the outer edge of the frame is extremely high. When the user holds the electronic device, due to the large size of the current electronic device (for example, the mainstream of the touch mobile phone is more than 5 inches), the user can hardly fully grasp it. Using the grip between fingers, the contact points or positions for gripping electronic devices are mostly located on the outer edge or longer sides of the middle frame, causing high temperature conduction to the outer edge of the middle frame, which will affect or cause troubles for users in use and inconvenient

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