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Methods and apparatus for deposition and formation of conductive elements

A technology of conductive elements and equipment, applied in the field of deposition and formation of conductive elements and equipment, can solve problems such as fragility, high cost, and unsatisfactory properties of thermoplastic materials

Active Publication Date: 2021-04-06
PULSE FINLAND
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0009] Although a very capable technology, LDS also has some disadvantages; specialized thermoplastic material properties do not meet those of traditional polymeric materials, but are typically more brittle or brittle
Another disadvantage is the overall cost; specialized thermoplastic resins cost more than traditional thermoplastic resins, and the laser and coating processes are expensive
The capital cost of LDS production also represents a significant barrier to entry into the technology

Method used

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  • Methods and apparatus for deposition and formation of conductive elements
  • Methods and apparatus for deposition and formation of conductive elements
  • Methods and apparatus for deposition and formation of conductive elements

Examples

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Embodiment Construction

[0047] The present disclosure relates, in one aspect, to an article of manufacture, including, in one variation, a conductive element (eg, an antenna) formed onto a substrate. An exemplary antenna embodiment includes a plurality of connected conductive traces. Traces may extend across planar or non-planar or three-dimensional substrates. According to the present disclosure, a plurality of traces are formed in one exemplary embodiment by moving a dispensing or deposition head nozzle over a substrate to form each trace.

[0048] In some implementations, the present disclosure enables the deposition of conductive traces (e.g., antennas) having a thickness, such as approximately at least at a specified frequency (e.g., 1 GHz (gigahertz)), with a single pass or stroke of the nozzle. Factor (n) of the measured penetration depth δ. For example, n is equal to at least 2 (ie, the thickness is at least 2×δ) in some variations, and equal to at least 3 (3×δ) in other variations. .

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PUM

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Abstract

A conductive element, such as an antenna, for use in electronic devices, including mobile devices such as cellular phones, smart phones, personal digital assistants (PDAs), notebook computers, and wireless tablets. In one exemplary aspect, the present disclosure relates to conductive antennas formed using deposition conductive fluids and methods and apparatus for forming conductive antennas. In one embodiment, a "thick" antenna element can be formed in one pass of the dispensing head or nozzle, thereby reducing manufacturing cost and increasing manufacturing efficiency.

Description

[0001] Priority and related applications [0002] This application claims priority to co-pending and commonly owned U.S. Patent Application Serial No. 14 / ____ filed February __, 2014 of the same title, which claims the same title of 2014 2 Priority to US Provisional Patent Application Serial No. 61 / 939,197 filed on March 12, each of which is incorporated herein by reference in its entirety. [0003] This application is also related to commonly owned and co-pending U.S. Patent Application Serial No. 13 / 782993 filed March 1, 2013 of the same title, which claims the U.S. Provisional Patent Application Serial No. 61 / 606320, U.S. Provisional Patent Application Serial No. 61 / 609868 filed March 12, 2012 of the same title and Serial No. 61 filed January 8, 2013 of the same title / 750207, each of which is incorporated herein by reference in its entirety. [0004] This international application is also related to commonly owned and co-pending U.S. Provisional Patent Application Serial N...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01Q1/38H05K3/12H01Q1/24
CPCH01Q1/241H01Q1/38H05K3/125H05K2201/0245H05K2201/0999H05K2201/10098
Inventor E.卡里斯特贾E.加尔拉D.库伊勒W.钱德斯
Owner PULSE FINLAND
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