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Three-Dimensional Forming Device, Three-Dimensional Forming Method, And Three-Dimensional Formed Article

A formed, three-dimensional technology, applied in the directions of transportation and packaging, additive manufacturing, process efficiency improvement, etc., can solve problems such as increasing the cost of large-scale installations

Pending Publication Date: 2017-03-08
SEIKO EPSON CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, in the manufacturing method of the three-dimensional formed object disclosed in Patent Document 1, in order to realize the improvement of productivity and the improvement of forming accuracy, for example, it is necessary to use a combination of a formable beam capable of irradiating a widened melting and solidification width and a beam for precise forming. The method has a plurality of beam irradiation units, which leads to an increase in the size of the device or an increase in the cost of the device

Method used

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  • Three-Dimensional Forming Device, Three-Dimensional Forming Method, And Three-Dimensional Formed Article

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no. 1 approach

[0094] figure 1 It is a schematic configuration diagram showing the configuration of the three-dimensional forming apparatus according to the first embodiment. In addition, "three-dimensional formation" in this specification means formation of a so-called three-dimensional shaped object, for example, even a flat shape, that is, a shape of a so-called two-dimensional shape, including the case of forming a shape having a thickness.

[0095] like figure 1 As shown, the three-dimensional forming apparatus 1000 includes a base 10 and a table 20 that can be driven in the X, Y, and Z directions shown in the figure by a drive device 11 as a drive unit included in the base 10 . Furthermore, the head support part 30 is provided with: a head 31 as a holding unit, holding a material supply unit and an energy irradiation unit described later; and a support arm 32 whose one end is fixed to the base 10 and which The head 31 remains fixed to the other end. In addition, the lamp support par...

no. 2 approach

[0130] The three-dimensional forming method of the second embodiment is a method of forming the three-dimensional formed object 200 by the three-dimensional forming apparatus 1000 of the above-described first embodiment. exist Figure 8 A flowchart showing a method of forming the three-dimensional formed object 200 of the second embodiment is shown in Figure 9 to Figure 27 shown in Figure 8 The formation method in each process of the shown flowchart.

[0131] (Data acquisition process for 3D modeling)

[0132] like Figure 8 As shown, in the three-dimensional forming method of the present embodiment, the control unit 100 (refer to figure 1 ), which is not shown in the figure, for example, a personal computer, etc., acquires the three-dimensional modeling data of the three-dimensional formed object 200, and executes the three-dimensional modeling data acquisition step (S100). The three-dimensional modeling data acquired in the three-dimensional modeling data acquisition ...

no. 3 approach

[0176] As the third embodiment, the three-dimensional formed object 200 obtained by the three-dimensional forming method of the second embodiment will be described using the three-dimensional forming apparatus 1000 of the first embodiment. In addition, the "three-dimensional formation" in this specification refers to an object formed into a so-called three-dimensional shaped object. For example, even a flat-shaped, that is, a so-called two-dimensional shaped object, as long as it has a thickness, includes within the three-dimensional formation.

[0177] Figure 28 It is a cross-sectional view schematically showing the three-dimensional formed object 200 of the third embodiment formed on the plate 21 of the three-dimensional forming apparatus 1000 . Furthermore, for Figure 28 The shape and form of the three-dimensional formed object 200 shown are not particularly limited. In this example, for convenience of description, although not shown, rectangular flat plates are formed ...

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Abstract

A three-dimensional forming device is a three-dimensional forming device which forms a three-dimensional formed article by stacking a layer using a sintering material containing a metal powder, a binder, and a solvent, and includes a material supply section which supplies the sintering material to a predetermined material supply region, a first heating section which heats the predetermined material supply region, a second heating section which heats the sintering material supplied to the predetermined material supply region from the material supply section, and an energy irradiation section which supplies energy for sintering the metal powder.

Description

technical field [0001] The present invention relates to a three-dimensional forming apparatus, a three-dimensional forming method, and a three-dimensional forming object. Background technique [0002] Conventionally, as a method for easily forming a three-dimensional shape using a metal material, a method such as that shown in Patent Document 1 has been disclosed. The method for forming a three-dimensional formed product disclosed in Patent Document 1 uses a metal paste having a metal powder, a solvent, and an adhesion enhancer in a raw material as a layered material layer. Then, the layered material layer is irradiated with a light beam to form a metal sintered layer or a metal fused layer, and by repeating the formation of the material layer and the irradiation of the light beam, the sintered layer or the fused layer is stacked to obtain a desired three-dimensional formation. [0003] However, in the method for forming a three-dimensional formed object disclosed in Patent...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B22F3/105B33Y10/00B33Y30/00B33Y80/00B22F1/10
CPCB33Y10/00B33Y30/00B33Y80/00B22F3/003B22F10/00B22F12/53B22F10/28B22F10/30B22F2999/00B22F1/10B22F10/20B22F3/1021B22F2203/03B22F2998/10Y02P10/25B33Y50/02
Inventor 宫下武大西一大竹俊裕鎌仓知之
Owner SEIKO EPSON CORP