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Horizontal Infrastructure Handling For Integrated Circuit Devices

A technology of integrated circuits and processors, applied in electrical digital data processing, circuits, measuring devices, etc., can solve the problems of low quality, error-prone, high order volume, etc., and achieve the effect of reducing manufacturing costs, fast and reliable labor

Active Publication Date: 2017-03-08
SKYWORKS SOLUTIONS INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] Component testing and programming of horizontal integrated circuit (IC) device products (i.e., small batches of custom-made IC components programmed for different purposes) is very manual due to per-order customization, low part count per order, and high order volume. dense and error-prone
These custom IC device components are low quality high order volume products that, with conventional manufacturing and programming processes, require the efforts of a large number of individual human operators for each order

Method used

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  • Horizontal Infrastructure Handling For Integrated Circuit Devices
  • Horizontal Infrastructure Handling For Integrated Circuit Devices
  • Horizontal Infrastructure Handling For Integrated Circuit Devices

Examples

Experimental program
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Embodiment Construction

[0019] figure 2 An exemplary embodiment of an architecture 200 is described that can be used to simultaneously create and run multiple aggregated custom IC device part orders. In this embodiment, architecture 200 may be used for component testing and programming of a plurality of different types of custom horizontal integrated circuit (IC) device products from a plurality of incoming non-custom base IC device components 203 of a common type. An incoming non-custom base IC device part 203 may be previously assembled, assembled, and package tested (e.g., base part test), as image 3 shown in . As shown, multiple different individual custom IC device component orders 211 1 to 211 N Logic provided to the combined billing, order and manufacturing execution system (BKO / MES) 202 . For example, custom IC device component orders 211 may be received from one or more customers of an IC device product manufacturer. Each of the plurality of custom part orders 211 may specify a batch ...

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Abstract

The invention provides a horizontal infrastructure handling for integrated circuit devices. Systems and methods are provided that may be implemented to produce customized integrated circuit (IC) device parts together from a common base IC device part that is customized with settings or code to build different unique IC device parts for different purposes that are processed and output together from the manufacturing process. Different individual devices of the common base part may be customized (e.g., programmed) with different settings and / or code to build respective uniquely configured parts for different purposes, e.g., such as according to different respective part orders.

Description

technical field [0001] The present disclosure relates generally to integrated circuit devices, and more particularly, to programming and testing of integrated circuit devices. Background technique [0002] Component testing and programming of horizontal integrated circuit (IC) device products (i.e., small batches of custom-made IC components programmed for different purposes) is very manual due to per-order customization, low part count per order, and high order volume. Dense and error-prone. These custom IC device components are low quality high order volume products that, with conventional manufacturing and programming processes, require the efforts of a large number of individual human operators for each order. Exporting IC device components is handled individually in a disc package with media, which also requires extensive documentation and effort to handle and ship. The overall fabrication and programming process for such custom IC devices requires a long list of task...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06Q30/06G06F11/22G06K17/00G01R31/28
CPCG01R31/2851G06F11/2205G06K17/0022G06Q30/0621G06Q30/0635G01R31/2868H01L22/14H01L22/20G06F11/263G06F11/2733G06F30/333
Inventor D·利特尔约翰
Owner SKYWORKS SOLUTIONS INC
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