Air intake vent temperature correction method based on GPU power consumption and environment temperature

Abstract

The invention discloses an air intake vent temperature correction method based on GPU power consumption and environment temperature. The specific method is as follows: S1, acquiring feedback environment temperature data and power consumption data of a backboard in real time; S2, computationally analyzing the environment temperature to work out a correction coefficient, and computationally analyzing the power consumption data to work out a correction coefficient; S3, adding the two correction coefficients, and then adding a constant value coefficient; S4, outputting real-time and effective Intel sensor feedback value. Compared with the prior art, the feedback value of an Inlet sensor is corrected according to the power consumption and the environment temperature of the backboard by use of the air intake vent temperature correction method based on GPU power consumption and environment temperature, so that the environment temperature can be accurately and really reflected by excluding multiple factors; therefore, not only can the requirement of a customer be satisfied, but also the rotational speed of a fan can be accurately and efficiently controlled in cooperation with a regulating strategy, the power waste caused by excessive rotational speed of the fan is avoided, and the excessive temperature risk caused by too low rotational speed is further avoided.

Description

Technical field [0001] The invention relates to the technical field of computer processing, in particular to an air inlet temperature correction method based on GPU power consumption and ambient temperature. Background technique [0002] With the development of new technologies such as cloud computing and big data, node power consumption is getting higher and higher, and customers have higher and higher requirements for air inlet temperature. [0003] TDP is an indicator that reflects the heat release of a processor. The full English name of TDP is "Thermal DesignPower", and the Chinese literal translation is "thermal design power." TDP power consumption is the basic physical indicator of the processor. Its meaning is the heat released when the processor reaches its maximum load, in watts (W). The TDP value of a single processor is fixed, and the heat sink must ensure that the processor temperature is still within the design range when the processor TDP is at its maximum. [0004...

AI Technical Summary

Problems solved by technology

[0007] If only the power consumption is used for correction, the fan speed of the cabinet will be different under different ambient temperatures. The higher the temperature, the higher the fan speed, and the higher the ventilation volume of the air duct, resulting in better heat dissipation. Naturally, it is not accurate enough to correct only based on power consumption; If the correction is only made based on the ambient temperature, the high power consumption will cause the board to overheat, and the temperature will be relatively high, which is naturally inaccurate after correction.

Images