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A Method for Obtaining Mobility Parameters of Grain Boundary in Metal Material Recrystallization Microstructure Evolution

A technology of recrystallization structure and metal materials, which is applied to the analysis of materials, material analysis through optical means, material analysis using wave/particle radiation, etc. It can solve the problems that cannot be directly measured through experiments, and achieve the effect of improving accuracy

Active Publication Date: 2019-06-04
AVIC BEIJING INST OF AERONAUTICAL MATERIALS
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] The present invention is aimed at the deficiencies in the above-mentioned prior art and provides a method for obtaining the mobility parameter of the grain boundary of the recrystallization structure evolution of the metal material. For the problem of measurement, the method of the present invention uses the recrystallization grain size measurement, combined with the microstructure evolution numerical simulation method, to reverse the recrystallization grain boundary mobility parameter, which significantly improves the accuracy and practical value of this parameter

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  • A Method for Obtaining Mobility Parameters of Grain Boundary in Metal Material Recrystallization Microstructure Evolution
  • A Method for Obtaining Mobility Parameters of Grain Boundary in Metal Material Recrystallization Microstructure Evolution
  • A Method for Obtaining Mobility Parameters of Grain Boundary in Metal Material Recrystallization Microstructure Evolution

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Embodiment 1

[0037] The method for obtaining the mobility parameter of the grain boundary of the recrystallization structure evolution of the metal material is characterized in that the steps of the method are as follows:

[0038] Step 1: Physical and thermal simulation experiment of dynamic recrystallization of 304L austenitic stainless steel

[0039] First measure the initial average grain size of the sample before deformation, and the initial grain size is 35 μm. Then five sets of samples were prepared, and the Gleeble thermal simulator was used for plane compression experiments. The deformation rate was 0.01 / s, and the deformation temperatures were 800°C, 850°C, 900°C, 1000°C, and 1100°C. Observe the records recorded by the Gleeble thermal simulator Stress-strain curve, when the stress-strain curve reaches the recrystallization steady-state stress value, the deformation is terminated, and the maximum deformation amount is 90% at this time;

[0040] Step 2: Use the microstructure charact...

Embodiment 2

[0059] The method for obtaining the mobility parameter of the grain boundary of the recrystallization structure evolution of the metal material is characterized in that the steps of the method are as follows:

[0060] Step 1: Physical and thermal simulation experiment of static recrystallization of pure copper

[0061] First measure the initial average grain size of the sample before deformation, and the initial grain size is 80 μm. Then use the Gleeble thermal simulator to carry out the plane compression test, the deformation amount is 50%, the annealing temperature is 500°C, 650°C, 700°C, 750°C, 800°C, and the annealing time is 300 seconds.

[0062] Step 2: Use the microstructure characterization experiment to obtain the average grain size of the static recrystallization of the sample

[0063] EBSD scanning electron microscopy is used to count the grain size of the sample, the recrystallization fraction of the sample reaches 100% to avoid the interference of non-recrystalli...

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Abstract

The invention relates to a method for acquiring a mobility parameter of a re-crystallized structure evolution crystal boundary of a metal material. The method comprises the following steps: (1) performing static re-crystallization or dynamic re-crystallization physical thermal simulation test on a metal material sample; (2) acquiring an average grain size of static re-crystallization or dynamic re-crystallization of the sample by utilizing a microstructure representation test; (3) establishing a re-crystallization dynamical model on the basis of a structural evolution numerical simulation method, wherein the model includes nucleation and growing sub-models; (4) describing a nucleation rate sub-model through a nucleation rate, excluding the parameters, such as nucleation activation energy, difficult to acquire through the test and the parameters without physical significance; (5) expressing the migration rate of the crystal boundary of a re-crystallization growing sub-model by the product of the driving force and the mobility parameter of the crystal boundary, wherein the mobility parameter of the crystal boundary is a unique fitting parameter in the whole model; (6) adjusting the mobility parameter of the crystal boundary by adopting an inverse optimization algorithm, comparing a numerical simulation result with a test result and confirming the parameter when a difference between the numerical simulation result with the test result is less than a threshold value (0.01-0.1).

Description

technical field [0001] The invention relates to a method for obtaining the mobility parameters of the grain boundary in the recrystallization structure evolution of metal materials, and belongs to the technical field of metal materials. Background technique [0002] The recrystallization of metal materials is a kind of microstructure evolution phenomenon that occurs after the metal undergoes cold or hot deformation. Due to the deformation, there is deformation storage energy inside the grain, which makes the system in an unstable high-energy state. With the deformation storage energy as the driving force, a new grain structure is regenerated through recrystallization nucleation and growth through the thermal activation process, making the system The spontaneous process of changing from a high-energy state to a relatively stable low-energy state is recrystallization. Generally, according to the relationship between recrystallization and plastic deformation, it can be divided...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G06F17/50C21D8/00G01N23/22G01N21/84
CPCC21D8/00G01N21/84G01N23/2202G01N23/2206G06F30/20
Inventor 肖纳敏刘天琦韦家虎
Owner AVIC BEIJING INST OF AERONAUTICAL MATERIALS
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