Die bonder and die bonding method

Abstract

The invention is applicable to the technical field of LED packaging, and provides a die bonder and a die bonding method. The die bonder comprises a worktable system used for moving an LED framework, a wafer positioning system used for positioning wafers, and a die bonding system used for picking up wafers and fixing the wafers on the LED framework, wherein the die bonding system comprises a die bonding arm, a rotary driving mechanism and a telescopic driving mechanism; the worktable system has a worktable; the rotary driving mechanism drives the die bonding arm to be perpendicular to the worktable or drive the die bonding arm and the worktable to rotate in a plane at a certain angle; and the telescopic driving mechanism drives the die bonding arm to perform linear telescopic movement. Moving mechanisms of the wafers and the LED framework are staggered in space layout without causing mutual interference, so that the problem in applicability of the large-dimensional LED framework is solved; therefore, the ultra-big and ultra-wide LED framework can be manufactured while the precision is not affected; original small LED frameworks can be assembled together, so that feeding and discharging time can be reduced, thereby improving the production efficiency.

Description

technical field [0001] The invention belongs to the technical field of LED packaging equipment, and in particular relates to a crystal bonding machine and a crystal bonding method. Background technique [0002] With the development of semiconductor technology, especially the development of LED lamp COB technology, the LED frame is getting bigger and bigger, such as ceiling lamps, the general size reaches 310mm*310mm, or even larger, and it is required to directly bond the crystal on the board (that is, stick the chip ). [0003] The die-bonding arm of the existing die-bonding machine on the market swings 90 degrees or 180 degrees in the horizontal plane to realize the die-bonding. The effective die-bonding range is limited by the length of the die-bonding arm. The longer the die-bonding arm, the more products that can be made. The wider the width, but at the same time, the length of the die bonding arm increases, the die bonding speed decreases, and the accuracy deteriorate...

AI Technical Summary

Problems solved by technology

[0005] The technical problem to be solved by the present invention is to provide a crystal bonding machine and a crystal bonding method, aiming to solve the problems of reduced crystal bonding speed and poor precision when the crystal bonding machine in the prior art is bonding large-sized LED frames. The problem

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