Die bonder and die bonding method

A crystal-bonding machine and crystal-bonding technology, which is applied in semiconductor/solid-state device manufacturing, electrical components, circuits, etc., can solve the problems of slow crystal-bonding speed and poor precision, so as to improve production efficiency, solve adaptability problems, save The effect of loading and unloading time

Inactive Publication Date: 2017-03-15
深圳市微恒自动化设备有限公司
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  • Abstract
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Problems solved by technology

[0005] The technical problem to be solved by the present invention is to provide a crystal bonding machine and a crystal bonding method, aiming to solve the problems of reduced crystal bonding speed and poor precision when the crystal bonding machine in the prior art is bonding large-sized LED frames. The problem

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Embodiment Construction

[0029] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.

[0030] The invention provides a crystal bonding machine, which includes a workbench system for moving an LED frame, a wafer positioning system for providing wafer positioning, and a crystal bonding system for fixing the wafer on the LED frame. The die-bonding system includes a die-bonding arm and a rotary drive mechanism for picking up and moving the wafer, and the table system has a table for placing the LED frame. The die bonding system also includes a telescopic drive mechanism. The rotary drive mechanism drives the die bond arm to rotate in a plane perpendicula...

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Abstract

The invention is applicable to the technical field of LED packaging, and provides a die bonder and a die bonding method. The die bonder comprises a worktable system used for moving an LED framework, a wafer positioning system used for positioning wafers, and a die bonding system used for picking up wafers and fixing the wafers on the LED framework, wherein the die bonding system comprises a die bonding arm, a rotary driving mechanism and a telescopic driving mechanism; the worktable system has a worktable; the rotary driving mechanism drives the die bonding arm to be perpendicular to the worktable or drive the die bonding arm and the worktable to rotate in a plane at a certain angle; and the telescopic driving mechanism drives the die bonding arm to perform linear telescopic movement. Moving mechanisms of the wafers and the LED framework are staggered in space layout without causing mutual interference, so that the problem in applicability of the large-dimensional LED framework is solved; therefore, the ultra-big and ultra-wide LED framework can be manufactured while the precision is not affected; original small LED frameworks can be assembled together, so that feeding and discharging time can be reduced, thereby improving the production efficiency.

Description

technical field [0001] The invention belongs to the technical field of LED packaging equipment, and in particular relates to a crystal bonding machine and a crystal bonding method. Background technique [0002] With the development of semiconductor technology, especially the development of LED lamp COB technology, the LED frame is getting bigger and bigger, such as ceiling lamps, the general size reaches 310mm*310mm, or even larger, and it is required to directly bond the crystal on the board (that is, stick the chip ). [0003] The die-bonding arm of the existing die-bonding machine on the market swings 90 degrees or 180 degrees in the horizontal plane to realize the die-bonding. The effective die-bonding range is limited by the length of the die-bonding arm. The longer the die-bonding arm, the more products that can be made. The wider the width, but at the same time, the length of the die bonding arm increases, the die bonding speed decreases, and the accuracy deteriorate...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/52H01L21/67
CPCH01L33/52H01L21/67121H01L21/67126
Inventor 唐文轩
Owner 深圳市微恒自动化设备有限公司
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