A flexible hinge-guided plane xyθ three-degree-of-freedom precision compensator

Abstract

The invention discloses a flexible hinge-guided plane X Y theta three-degree-of-freedom precision compensator. The flexible hinge-guided plane X Y theta three-degree-of-freedom precision compensator comprises a compensation device and a mounting base; the compensation device includes three sets of fixed blocks, a terminal actuator, three displacement driving devices, and three sets of three flexible branched chains respectively connected between each fixed block and the terminal actuator; the fixed blocks are fixed on the mounting base; the three fixed blocks are arranged around the terminal actuator in an annular array form; two ends of the flexible branched chains are hinged to the terminal actuator and the fixed blocks through hinges; the displacement driving devices are restrained on the fixed blocks; and the end parts of the displacement driving devices are fixed at a tail section of a first lever through screws. A transmission device formed by the three sets of flexible branched chains achieves an amplifying effect, and can output and amplify fine displacements of the displacement driving devices as bigger displacements to drive the terminal actuator to obtain a larger operation adjusting space, so that the displacements generated by the driving devices can be quickly transferred to the terminal actuator through the flexible branched chains.

Description

technical field [0001] The invention relates to the technical field of micro-operation in IC packaging technology, in particular to a plane XYθ three-degree-of-freedom precision compensator guided by a flexible hinge. Background technique [0002] The IC industry is the current growth point of global economic development and the most dynamic industry in my country's national economy. As an important part of the chip industry, the chip packaging industry has consistently followed the development of the IC industry, and the continuous improvement of chip integration has made IC packaging technology develop in the direction of high integration, high performance and fine pitch. [0003] The compliant parallel mechanism technology to be used as a chip package faces many challenges. On the one hand, the compliant joint is limited in its working space due to its own deformation limitation, which is limited to a cubic micron-scale space. At the same time, it involves the rational de...

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Problems solved by technology

[0003] The compliant parallel mechanism technology to be used as a chip package faces many challenges. On the one hand, the compliant joints are limited in their working space due to their own deformation limitations, which are limited to a cubic micron space. At the same time, it involves the rational design of compliant joints and compliant parallel connections. The rational layout of the organization and other issues

[0004] More micro-motion platforms generally use piezoelectric elements as drives. Based on this, a variety of precision micro-motion mechanisms have been developed to achieve micron or even sub-micron plane positioning. However, precision micro-motion mechanisms face many problems. Due to the limitation of its own deformation, the working space is limited, and at the same time, it involves the reasonable design of the compliant joints and the reasonable layout of the compliant parallel mechanism.

For example: Japanese patent JP63096431 discloses a kind of micro-motion stage, this micro-motion stage adopts piezoelectric chip as drive, uses flexible hinge as connection, but can only realize the adjustment of XY two dimensions; Although this kind of micro-motion stage has better The bearing capacity, but it does not have the function of rotating in the XY range, the adjustment range is relatively limited, so it is difficult to adjust the angle

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