Light-emitting diode packaging structure
A technology of light-emitting diodes and packaging structures, which is applied to semiconductor devices, electrical components, circuits, etc., can solve problems such as vibration, tearing, and circuit breakage, and achieve the effect of avoiding pulling and increasing the yield rate
Active Publication Date: 2019-01-29
DONGGUAN SINOWIN OPTO ELECTRONICS
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Problems solved by technology
However, in the actual production process, since the first electrode, the second electrode, and the light-emitting diode chip are respectively soldered to the first wire and the second wire before packaging in a package, the handling and transmission process after welding and before packaging is prone to vibration. Since the second electrode is separated from the first electrode, the second wire connecting the light-emitting diode chip and the second electrode is easily torn apart during vibration, resulting in an open circuit, so that the packaged light-emitting diode is a defective product
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[0017] In order to facilitate the understanding of the present invention, the following will describe the present invention more fully. However, the present invention can be embodied in many different forms and is not limited to the embodiments described herein. On the contrary, these embodiments are provided to make the understanding of the disclosure of the present invention more thorough and comprehensive.
[0018] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the technical field of the invention. The terms used herein in the description of the present invention are for the purpose of describing specific embodiments only, and are not intended to limit the present invention.
[0019] see figure 1 and figure 2 , is a light emitting diode packaging structure 100 according to a preferred embodiment of the present invention, including a first electrode 10, a second electrode 2...
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The invention discloses a light-emitting diode packaging structure, which comprises a first electrode, a second electrode, a light-emitting diode chip located on the first electrode, a first wire, a second wire and a packaging body, wherein the first wire is electrically connected with the first electrode and the light-emitting diode chip separately; the second wire is electrically connected with the second electrode and the light-emitting diode chip separately; the packaging body packages the first electrode, the second electrode, the first wire, the second wire and the light-emitting diode chip; the second wire comprises a first straight segment, a second straight segment and a middle straight segment; one end of the first straight segment is electrically connected with the second electrode; one end of the second straight segment is electrically connected with the light-emitting diode chip; and the middle straight segment is connected to the first straight segment and the second straight segment. According to the light-emitting diode packaging structure, the second wire is provided with at least two obvious bending points through arranging the second wire connected to the second electrode and the light-emitting diode chip; direct pulling of welding spots is avoided through supporting deformation on the second wire; and the yield in the manufacturing process is improved.
Description
technical field [0001] The invention relates to a semiconductor packaging structure, in particular to a packaging structure of a light emitting diode. Background technique [0002] Compared with traditional light sources, light emitting diodes (Light Emitting Diode, LED) have the advantages of light weight, small size, energy saving and environmental protection, and high luminous efficiency. As a new type of light source, it has been widely used more and more In the fields of indication, display, decoration, backlight, general lighting and urban night scene. [0003] The existing LED packaging structure usually includes a first electrode, a second electrode, a LED chip located on the first electrode, a first wire electrically connected to the first electrode and the LED chip, and a wire respectively connected to the second electrode and the LED chip. The second wire electrically connected to the light emitting diode chip and the packaging body; the first wire and the second...
Claims
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IPC IPC(8): H01L33/48H01L33/62
CPCH01L2224/4809H01L2224/48247
Inventor 尹梓伟张万功
Owner DONGGUAN SINOWIN OPTO ELECTRONICS