Gluing antiglare processing device for LED (Light Emitting Diode) lamp module

A technology of LED lamp module and processing device, which is applied in the direction of pretreatment surface, device for coating liquid on the surface, coating, etc., can solve the problems of inconvenient gluing treatment, inconvenient glue layer stripe treatment, etc.

Inactive Publication Date: 2017-03-29
ZHONGSHAN MIGEER LIGHTING CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Existing LED light modules are inconvenient for gluing, and it is also inconvenient for striping the glue layer

Method used

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  • Gluing antiglare processing device for LED (Light Emitting Diode) lamp module

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Embodiment Construction

[0016] The present invention will be further described below in conjunction with the accompanying drawings.

[0017] like figure 1 As shown, the anti-glare treatment device for gluing LED lamp modules according to the present invention includes a base plate 11, a first side plate 12 is provided on one side of the base plate 11, and a second side plate 12 is provided on the other side of the base plate 11. Plate 13, the second side plate 13 and the first side plate 12 are arranged vertically, a top plate 14 is provided between the second side plate 13 and the first side plate 12; a first loading seat 15 is provided on one end of the bottom plate 11 , the first loading seat 15 is provided with a first limiting plate 16, the first limiting plate 16 is plugged with a first adjusting rod 17, the first adjusting rod 17 is arranged horizontally, and the outer surface of the first adjusting rod 17 is set There are external threads, the first adjusting rod 17 is threadedly connected w...

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Abstract

The invention relates to a gluing antiglare processing device for an LED (Light Emitting Diode) lamp module. The gluing antiglare processing device comprises a base plate, wherein side plates are arranged on the base plate; a top plate is arranged between the side plates of the base plates; object carrying seats are arranged on the base plate; a limiting plate is arranged on each object carrying seat; an adjusting rod is inserted in each limiting plate; a lock plate is arranged at an inward face position of each limiting plate; one end of each adjusting rod is connected with the corresponding lock plate; the outer end of each adjusting rod is a free end; a buckling sheet is arranged at the upper part of each limiting plate; air cylinders are arranged at the lower part of the top plate; a telescopic shaft is arranged at the lower part of each air cylinder; a screen plate is arranged between the lower ends of the telescopic shafts; a gluing film is arranged on the screen plate; a glue conveying machine is arranged at the lower part of the top plate; a glue conveying pipeline is arranged at the lower part of the glue conveying machine; a glue applying casing is arranged at the lower part of the glue conveying pipeline; a plurality of glue outlet holes are formed in the lower part of the glue applying casing; a control switch and a control pump are arranged on the glue conveying pipeline; the screen plate is arranged below the glue applying casing. The invention aims to facilitate the gluing for the LED lamp module; in addition, a glue layer can be subjected to stripe processing by meshes in the screen plate; the gluing antiglare processing device has an antiglare effect.

Description

technical field [0001] The invention relates to an anti-glare processing device, in particular to an anti-glare processing device for gluing LED lamp modules. Background technique [0002] Compared with the luminous effect of traditional light sources, LED light sources are low-voltage microelectronic products that successfully integrate computer technology, network communication technology, image processing technology and embedded control technology. The table structure, inverted pyramid structure and flip chip design of LED die molding can improve its luminous efficiency, so as to emit more light. Innovations in LED package design include high-conductivity metal block substrates, flip-chip designs, and bare-disk cast leadframes, all of which allow the design of high-power, low-thermal-resistance devices that deliver higher illuminance than conventional LEDs. The illumination of the product is greater. To make an LED emit white light, its spectral characteristics should i...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B05C5/02B05C13/02B05D3/00
CPCB05C5/02B05C13/02B05D3/007
Inventor 杨林莫经平
Owner ZHONGSHAN MIGEER LIGHTING CO LTD
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