Chip temperature testing device and testing method

A chip and equipment technology, applied in the equipment and testing field for chip temperature testing, can solve the problem of high cost of use, and achieve the effects of low cost, reasonable design, and simple structure

Inactive Publication Date: 2017-03-29
武汉昊昱微电子股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, several large test and sorting machine equipment companies in foreign countries have the manufacturing capacity of high and low temperature, especially low temperature -40 ℃ test and sorting, but most of them use liquid nitrogen refrigeration method, which is expensive

Method used

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  • Chip temperature testing device and testing method
  • Chip temperature testing device and testing method

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Experimental program
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Embodiment

[0019] First, introduce the specific structure of the present invention. The present invention includes a high and low temperature main engine 1, a high and low temperature box body 16 communicated with the high and low temperature main engine 1 through the inlet pipe 2 and the return air pipe 3, and a high and low temperature box body connected to the high and low temperature box body through the drying air pipe 4. 16 connected drying towers 5.

[0020] Wherein, the high and low temperature box 16 includes a base plate 6, and the base plate 6 is provided with a test track for passing the integrated circuit chip and a test assembly connected with the test track; the four sides of the base plate 6 are provided with side plates perpendicular to the base plate 6, That is, two short side plates 7 and two long side plates 8, wherein the two short side plates 7 are provided with grooves 9, the bottom of the groove 9 is buried with a heating rod, and the bottom plate 6 is provided wit...

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PUM

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Abstract

The invention relates to a chip temperature testing device and a testing method. The chip temperature testing device comprises a high-low temperature host machine, a high-low temperature box which is communicated with the high-low temperature host machine through an air inlet pipe and an air return pipe, and a drying tower which is communicated with the high-low temperature box through a drying air pipe. Therefore, the chip temperature testing device has the following advantages: 1, the device is reasonable in design, simple in structure and totally practical; 2, the device can realize ideal testing conditions which are the same as that of a laboratory high-low temperature box, so that the device is enabled to be applied to batch production; and 3, the device is low in cost and energy consumption.

Description

technical field [0001] The invention relates to a testing device and a testing method, in particular to a chip temperature testing device and a testing method. Background technique [0002] The application of integrated circuit chips is becoming more and more extensive, and the test and production of some integrated circuit chips with special applications need to be carried out in a high and low temperature environment. At present, several large foreign test and sorting machine equipment companies have the manufacturing capacity of high and low temperature, especially low temperature -40 degree test and sorting, but most of them use liquid nitrogen refrigeration, which is expensive to use. Contents of the invention [0003] The present invention mainly solves the technical problems existing in the prior art; it provides a device for chip temperature test which can reach the same ideal test conditions as the laboratory high and low temperature box, so that it can be applied...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01R31/28
Inventor 詹伟
Owner 武汉昊昱微电子股份有限公司
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