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Direct exposure apparatus

An exposure device and a direct-writing technology, which can be used in photolithographic process exposure devices, microlithography exposure equipment, printed circuits, etc., can solve problems such as exposure failure

Active Publication Date: 2017-04-19
MURATA MFG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

On the other hand, the reflected light formed by other micromirrors M is irradiated to a position far away from the photosensitive resin PP, and has no effect on exposure.

Method used

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Embodiment Construction

[0078] Embodiments of the present invention will be shown below, and features of the present invention will be described in more detail.

[0079]

[0080] use figure 1 and figure 2 Embodiments of the direct writing exposure apparatus according to the present invention will be described.

[0081] figure 1 It is a cross-sectional view of the direct writing exposure apparatus 100 according to this embodiment. figure 2 It is a top view of the main part of the direct writing exposure apparatus 100 which concerns on this embodiment. figure 1 to contain figure 2 The sectional view of the arrow direction of the plane of the Y1-Y1 line.

[0082] refer to figure 1 and figure 2 The direct writing exposure apparatus 100 according to this embodiment utilizes the following structure, and directly irradiates the exposure light 1b to the film-shaped photosensitive resin PP held on the upper surface of the plate-shaped base material B in a predetermined pattern. Make a patter...

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Abstract

This direct exposure apparatus (100) performs pattern exposure by directly applying an exposure light beam (1b) to a film-like photosensitive resin (PP) retained in a substrate (B), and includes: a light source (1) that outputs the exposure light beam (1b); a base (2); displacement mechanisms (4a-4d) that are able to support the peripheral region of the lower surface of the substrate (B) and operate so as to displace the substrate (B) in the optical axis direction of the exposure light beam (1b); and a support member (7) that is able to support the central region of the lower surface of the substrate (B). The support member (7) is disposed above the base (2) such that the optical axis of the exposure light beam (1b) is orthogonal to the upper surface of the support member (7) in a state where the substrate (B) is displaced by the displacement mechanisms (4a-4d) to bring the upper surface of the support member (7) and the central region of the lower surface of the substrate (B) into contact with each other.

Description

technical field [0001] The present invention relates to a direct writing exposure device for pattern-exposing a photosensitive resin by directly irradiating light having a wavelength in an ultraviolet region to a photosensitive resin without a mask to draw a predetermined pattern. Background technique [0002] In the manufacture of electronic devices, screen printing is often used to form wiring patterns and electrode patterns. [0003] Screen printing is a technique of printing ink on an object through a screen printing plate. The screen printing plate is made of a mesh cloth called gauze stretched on a frame to form a printing plate with a predetermined opening pattern. . [0004] Screen printing plate making is carried out by applying a photosensitive resin on the yarn, exposing it by irradiating ultraviolet light through a mask (original plate), and then washing and removing unnecessary parts (developing) to obtain a predetermined opening pattern. . [0005] However, ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G03F7/20B41C1/00H05K3/00
CPCB41C1/00G03F7/20H05K3/00
Inventor 松冈尚弥山根茂树
Owner MURATA MFG CO LTD