Heat dissipation apparatus and electronic device

A technology for heat dissipation devices and electronic equipment, applied in the fields of electrical digital data processing, instruments, calculations, etc., can solve problems such as undeveloped technical solutions, achieve the effect of improving heat dissipation efficiency and realizing heat recovery

Active Publication Date: 2017-04-26
LENOVO (BEIJING) CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, in the prior art, there is no relevant technical solution

Method used

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  • Heat dissipation apparatus and electronic device

Examples

Experimental program
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Effect test

Embodiment 1

[0031] An embodiment of the present invention provides a heat dissipation device. image 3 It is a schematic diagram of the first composition and structure of the heat dissipation device of the embodiment of the present invention; image 3 As shown, the heat dissipation device includes: a thermoelectric generator 11, a heat sink and a first element 14; the heat sink includes a cold end 13 and a hot end 12; the first end of the thermoelectric generator 11 and the heat sink The hot end 12 of the heat sink is bonded and connected to absorb the heat of the hot end 12 of the heat sink; the second end of the thermoelectric generator 11 is bonded to the cold end 13 of the heat sink, so that the second end forming a temperature difference between the end and the first end;

[0032] The thermoelectric generator 11 is used to convert the temperature difference formed between the first end and the second end into a voltage, and output the voltage to the first element 14, so that the fir...

Embodiment 2

[0039] The embodiment of the invention also provides a heat dissipation device. Figure 4It is a schematic diagram of the second composition and structure of the heat dissipation device of the embodiment of the present invention; Figure 4 As shown, the heat dissipation device includes: a thermoelectric generator 11, a heat sink and a first element 14; the heat sink includes a cold end and a hot end; the first end of the thermoelectric generator 11 and the heat sink of the heat sink The end 12 is bonded and connected to absorb the heat of the hot end 12 of the heat sink; the second end of the thermoelectric generator 11 is bonded to the cold end 13 of the heat sink, so that the second end and the cold end 13 of the heat sink are bonded. forming a temperature difference at the first end;

[0040] The thermoelectric generator 11 is used to convert the temperature difference formed between the first end and the second end into a voltage, and output the voltage to the first eleme...

Embodiment 3

[0047] The embodiment of the present invention also provides an electronic device. Figure 5 It is a schematic diagram of the first composition and structure of the electronic device according to the embodiment of the present invention; Figure 5 As shown, the electronic equipment includes a heat sink; the heat sink includes: a thermoelectric generator 21, a heat sink and a first element; the heat sink includes a cold end and a hot end; the first end of the thermoelectric generator 21 Fitted and connected with the hot end 22 of the radiator, for absorbing the heat of the hot end 22 of the radiator; the second end of the thermoelectric generator 21 is bonded with the cold end 23 of the radiator, so as to forming a temperature differential between the second end and the first end;

[0048] The thermoelectric generator 21 is used to convert the temperature difference formed between the first end and the second end into a voltage, and output the voltage to the first element, so t...

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PUM

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Abstract

Embodiments of the present invention disclose a heat dissipation apparatus and an electronic device. The heat dissipation apparatus comprises a thermoelectric generator, a heat sink and a first element. The heat sink comprises a cold end and a heat end. A first end of the thermoelectric generator is fitted with and connected with the heat end of the heat sink and is used for absorbing heat of the heat end of the heat sink. A second end of the thermoelectric generator is fitted with the cold end of the heat sink so as to form a temperature difference between the second end and the first end. The thermoelectric generator is used for converting the temperature difference between the first end and the second end into a voltage, and outputting the voltage to the first element, so that the first element runs based on the voltage.

Description

technical field [0001] The heat dissipation technology of the present invention specifically relates to a heat dissipation device and electronic equipment. Background technique [0002] The cooling method of the central processing unit (CPU, Central Processing Unit) in the existing electronic equipment usually uses fluid (such as air or liquid) to absorb and carry the heat generated by the CPU to the outside of the electronic equipment. This approach does not recycle the heat generated by the CPU. If there is such a solution, recover the heat generated by the CPU, generate electricity based on the recovered heat, and generate electricity to drive a fan to cool the heat source. However, in the prior art, there is no relevant technical solution. Contents of the invention [0003] In order to solve the existing technical problems, the embodiments of the present invention provide a heat dissipation device and electronic equipment. [0004] In order to achieve the above obje...

Claims

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Application Information

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IPC IPC(8): G06F1/20
CPCG06F1/206
Inventor 贺潇
Owner LENOVO (BEIJING) CO LTD
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