Unlock instant, AI-driven research and patent intelligence for your innovation.

MEMS microphone encapsulation structure

A packaging structure and microphone technology, which is applied in the direction of loudspeakers, electrostatic transducer microphones, sensors, etc., can solve problems affecting PCB board installation, passivation layer thickness of MEMS microphone barriers, difficulty in improving MEMS microphone sensitivity and signal-to-noise ratio, etc. problem, to achieve the effect of increasing the volume of the back cavity, good versatility, increasing sensitivity and signal-to-noise ratio

Pending Publication Date: 2017-04-26
WUXI RED MICROELECTRONICS CORP
View PDF13 Cites 2 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Standard MEMS microphone packaging structure, such as the MEMS microphone disclosed in the Chinese invention patent with the notification number CN203748006U, the MEMS chip is directly arranged on the PCB board, the volume of the back cavity of the MEMS microphone is smaller than the MEMS chip itself, and all MEMS microphones have blunt barriers. The thickness of the metallization layer results in a very limited volume of the back cavity of the MEMS microphone, making it difficult to improve the sensitivity and signal-to-noise ratio of the MEMS microphone
[0004] There is also a Chinese invention patent with the notification number CN203368746U disclosing a microcomputer motor system microphone, which sets an external expansion cavity on the back of the PCB to increase the volume of the back cavity of the MEMS microphone, but such a structure will affect the installation of the PCB

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • MEMS microphone encapsulation structure

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0020] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0021] See figure 1 , a kind of MEMS microphone package structure of the present invention, comprises PCB board 1, is provided with metal casing 2 on PCB board 1, forms inner chamber 3 between metal casing 2 and PCB board 1, is provided with on metal casing 2 The through hole 4, the MEMS chip 5 is bonded on the metal shell 2 by an adhesive, the back cavity of the MEMS chip 5 is set facing the through hole 4, the back cavity of the MEMS chip 5 communicates with...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention provides an MEMS microphone encapsulation structure. With the structure adopted, the back cavity volume of MEMS microphones is increased, and the sensitivity and signal-to-noise ratio of MEMS microphones are increased. The MEMS microphone encapsulation structure comprises a PCB, and further comprises a metal shell, an MEMS chip, and an ASIC chip. The metal shell is arranged on the PCB, an inner cavity is formed between the metal shell and the PCB, and the metal shell has a through hole. The MEMS chip is arranged on the metal shell, the back cavity of the MEMS chip directly faces the through hole, and the back cavity of the MEMS chip is communicated with the inner cavity via the through hole. The ASIC chip is electrically connected with the MEMS chip and the PCB through wires.

Description

technical field [0001] The invention relates to the technical field of MEMS microphones, in particular to a MEMS microphone packaging structure. Background technique [0002] As mobile phones, notebooks, hearing aids and other electronic products require smaller and smaller internal parts, a large number of smaller and better quality MEMS microphones are used. For MEMS microphones, the key technology is the packaging structure. [0003] Standard MEMS microphone packaging structure, such as the MEMS microphone disclosed in the Chinese invention patent with the notification number CN203748006U, the MEMS chip is directly arranged on the PCB board, the volume of the back cavity of the MEMS microphone is smaller than the MEMS chip itself, and all MEMS microphones have blunt barriers. The thickness of the layer makes the volume of the back cavity of the MEMS microphone very limited, making it difficult to improve the sensitivity and signal-to-noise ratio of the MEMS microphone. ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): H04R19/04H04R31/00
CPCH04R19/04H04R31/00H04R2400/11
Inventor 王志超葛修坤徐震鸣董育智
Owner WUXI RED MICROELECTRONICS CORP