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43results about How to "Adapt to miniaturization" patented technology

Open architecture high-integration MPPT standardized module

The invention discloses an open architecture high-integration MPPT standardized module. The open architecture high-integration MPPT standardized module includes a plurality of MPPT standardized sub modules. Each MPPT standardized sub module includes a DC/DC circuit, an isolating diode, a protection diode, a positive input port, a negative input port, a positive output port and a negative output port. MPPT standardized module topology provided by the open framework high-integration MPPT standardized module has openness, modes such as input parallel and output series, parallel or parallel-seriesthrough can be achieved through connection of different input and output ports of the MPPT standardized sub modules, the output voltage is increased flexibly, the output power is extended flexibly, and the open architecture high-integration MPPT standardized module adapts to rapid assembling and flexible developing demands of micro-nano-satellite multitask; through the mode of input parallel + output series and parallel or series-parallel, the consistency problem caused by the excessive number of series connection of traditional input solar cells is solved, and the tracking accuracy of MPPT is improved, and the using rate of solar cell array energy is improved.
Owner:SHANGHAI INST OF SPACE POWER SOURCES

Manufacturing method of high-density inductor

The invention provides a manufacturing method of a high-density inductor. The manufacturing method comprises the steps: as follows: (A) a corrosion window is formed in the back surface of a silicon substrate after mask layers are deposited on the front surface and the back surface of the silicon substrate; (B) a deep pit structure located in the silicon substrate is formed along the corrosion window; (C) a first metal pattern layer is formed on the mask layer on the front surface of the silicon substrate; (D) a dielectric layer is subjected to spin-coating on the structure obtained in the step (C) and is patterned, so as to form a through hole which exposes partial first metal pattern layer; (E) a second metal pattern layer is formed on the structure obtained in the step (D), so that partial second metal pattern layer contacts the first metal pattern layer through the through hole; and (F) a composite magnetic material of benzocyclobutene (BCB) and magnetic powder is filled into the deep pit structure and is cured. The silicon substrate below a planar coil inductor is hollowed out by a dry and wet hybrid method corrosion technology; and the composite magnetic material is filled into the deep pit in the back surface of the inductor through a screen-printing technology. Therefore, the inductance value is improved.
Owner:SHANGHAI INST OF MICROSYSTEM & INFORMATION TECH CHINESE ACAD OF SCI

Cantilever type inertia switch

InactiveCN106024508AWith universal closing functionAdapt to miniaturizationElectric switchesCantileverInertial switch
The invention discloses a cantilever type inertia switch. The cantilever type inertia switch comprises a hollow cylindrical shell, an insulating base, an electrode stem and a spherical contact, and is characterized in that the insulating base is fixed at one end of an inner cavity of the cylindrical shell, the middle part of the insulating base is provided with a through hole, one end of the electrode stem is embedded into the through hole and fixedly connected with the insulating base, the other end of the electrode stem extends outward along the axial direction thereof, passes through the through hole and is suspended at the middle part of the inner cavity of the cylindrical shell, and the electrode stem is fixedly connected with the spherical contact. The inertia switch disclosed by the invention can overcome resistance of the electrode stem under an overload action in any directions except for the axial direction so as to carry out deflection movements until being contacted with the cylindrical shell, the inertia switch is closed, and an ignition control circuit is connected. The cantilever type inertia switch has a universal closing function, thereby solving a key technology for reliably triggering a hard target against fuse under a large striking angle condition, and enabling the fuse to act reliably under various missile and target intersection conditions.
Owner:湖北三江航天红林探控有限公司

Metasurface capable of realizing non-reciprocity function

ActiveCN110531458AHigh resolutionAchieve non-reciprocityPolarising elementsBrickEngineering
The invention discloses a metasurface capable of realizing the non-reciprocity function. The metasurface is formed by periodically arranging a plurality of unit structures in an array on a plane. Eachunit structure consists of a first nano brick, a second nano brick and a substrate layer. The substrate layer is a laminated structure with square upper and lower surfaces; and the first and second nano-bricks are respectively arranged on the upper and lower surfaces of the substrate layer. The first nanometer brick plays a role like a transmission type half-wave plate; and the second nanometer brick has the function of a transmission type polarizer. With the linear polarizer, the metasurface is capable of realizing independent intensity modulation on vertically incident transmission light from the first nano-brick and the second nano-brick. According to the invention, the metasurface has the independent intensity modulation capability on transmission light from the first nano-brick and the second nano-brick respectively and two independent high-resolution grayscale images can be generated in two transmission spaces to realize nonreciprocity. The metasurface can be applied to the fields of high-end display, virtual reality, augmented reality and the like; and a novel method and way are provided for the future safety technologies.
Owner:WUHAN UNIV

Manufacturing method of high-density inductor

The invention relates to a manufacturing method of a high-density inductor. The manufacturing method comprises the steps: as follows: (A) a corrosion window is formed in the back surface of a silicon substrate after mask layers are deposited on the front surface and the back surface of the silicon substrate; (B) a deep pit structure located in the silicon substrate is formed along the corrosion window; (C) a first metal pattern layer is formed on the mask layer on the front surface of the silicon substrate; (D) a dielectric layer is subjected to spin-coating on the structure obtained in the step (C) and is patterned, so as to form a through hole which exposes partial first metal pattern layer; (E) a second metal pattern layer is formed on the structure obtained in the step (D), so that partial second metal pattern layer contacts the first metal pattern layer through the through hole; and (F) a composite magnetic material of benzocyclobutene (BCB) and magnetic powder is filled into the deep pit structure and is cured. The silicon substrate below a planar coil inductor is hollowed out by a dry and wet hybrid method corrosion technology; and the composite magnetic material is filled into the deep pit in the back surface of the inductor and the right upper part of the inductor through a screen-printing technology, so as to form a sandwich structure (magnetic material-inductor-magnetic material). Therefore, the inductance value is improved.
Owner:SHANGHAI INST OF MICROSYSTEM & INFORMATION TECH CHINESE ACAD OF SCI

Antenna, transmission device and transmission mechanism

The invention discloses an antenna, a transmission device and a transmission mechanism. The transmission mechanism comprises a mounting part, an abutting part and a transmission shaft; the mounting part is provided with a first shaft body, the first shaft body is provided with a first outer tooth body, and the free end of the first outer tooth body is provided with a first leading-in tip part; theabutting part is provided with a matching hole matched with the first shaft body in a sleeving mode and a plurality of inner tooth bodies evenly arranged on the inner side wall of the matching hole at intervals, a limiting groove is formed between every two adjacent inner tooth bodies, and a second leading-in tip part is arranged at one end of each inner tooth body; one end of the transmission shaft is provided with a second shaft body matched with the matching hole in a sleeved mode, the second shaft body is provided with a second outer tooth body clamped with the limiting groove, and the second outer tooth body can be matched with the first outer tooth body in a calibration mode through the limiting groove. The transmission mechanism can reduce the jamming phenomenon. The transmission device adopts the transmission mechanism and has higher reliability. The antenna adopts the transmission device, and can adapt to miniaturization development.
Owner:COMBA TELECOM TECH (GUANGZHOU) CO LTD
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