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Copper alloy and method for production thereof

A manufacturing method and technology of copper alloys, applied in electrical components, circuits, contact parts, etc., can solve the problems of high strength, bending workability and stress relaxation resistance, and achieve the effect of excellent stress relaxation resistance

Inactive Publication Date: 2008-02-13
FURUKAWA ELECTRIC CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, as the miniaturization of connectors and the like progresses, high strength, bending workability, and stress relaxation resistance are required, and the above-mentioned technologies cannot fully satisfy all of these requirements.

Method used

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  • Copper alloy and method for production thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1～3、 comparative example 1～12

[0058] For an alloy composed of 8.0% by mass of Sn, 0.16% by mass of Fe and Ni in total, 0.07% by mass of P, and the balance of Cu and unavoidable impurities, sheets were produced under the above conditions, and their properties were evaluated. In addition, only Comparative Example 6 is an alloy composed of 8.0% by mass of Sn, 0.07% by mass of P, and the balance of Cu and unavoidable impurities.

[0059] In addition, in the comparative example, in the manufacturing process of the above-mentioned embodiment, except that the following changes are made, the others are carried out in the same manner as the embodiment. The comparative example 1 is carried out at 650 ° C for 2 hours of heat treatment c; the comparative example 2 is at 800 ° C. ℃ for 1 hour heat treatment d; comparative example 3 is heat treatment a at 280 ℃ for 20 seconds; comparative example 4 is heat treatment a at 620 ℃ for 20 seconds; comparative example 5 is 20 seconds at 580 ℃ The heat treatment a of comparati...

Embodiment 4～6、 comparative example 13～24

[0066] For an alloy composed of 10.0% by mass of Sn, 0.16% by mass of Fe and Ni in total, 0.07% by mass of P, and the balance of Cu and unavoidable impurities, sheets were produced under the above conditions, and their properties were evaluated. In addition, only Comparative Example 18 is an alloy composed of 10.0% by mass of Sn, 0.07% by mass of P, and the balance of Cu and unavoidable impurities.

[0067]In addition, in the comparative example, in the manufacturing process of the above-mentioned embodiment, except that the following changes are made, the others are carried out in the same manner as the embodiment. The comparative example 13 is to carry out heat treatment c for 2 hours at 650 ° C; ℃ for 1 hour heat treatment d; comparative example 15 was heat treatment a at 280 ℃ for 20 seconds; comparative example 16 was heat treatment a at 620 ℃ for 20 seconds; comparative example 17 was 20 seconds at 580 ℃ The heat treatment a of comparative example 19 is to carry out the ...

Embodiment 7～9、 comparative example 25～31

[0074] For an alloy composed of 12.0% by mass of Sn, 0.16% by mass of Fe and Ni in total, 0.07% by mass of P, and the balance of Cu and unavoidable impurities, sheets were produced under the above conditions, and their properties were evaluated. In addition, only Comparative Example 29 is an alloy composed of 12.0% by mass of Sn, 0.07% by mass of P, and the balance of Cu and unavoidable impurities.

[0075] In addition, in the comparative example, in the manufacturing process of the above-mentioned embodiment, except that the following changes are carried out, the others are carried out in the same manner as the embodiment. The comparative example 25 is to carry out heat treatment c for 2 hours at 650 ° C; ℃ for 20 seconds of heat treatment a; comparative example 27 was carried out at 620 ℃ for 20 seconds of heat treatment a; comparative example 28 was carried out at 580 ℃ for 20 seconds of heat treatment a; comparative example 30 was carried out at 850 ℃ for 8 hours Heat trea...

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Abstract

A copper alloy, having Sn 3.0 to 13.0 mass%, with the balance being Cu and unavoidable impurities, which copper alloy contains crystal grains whose diameter is 1.0 to 2.0 µm, and wherein the copper alloy has a precipitate X having a diameter of 1 to 50 nm and a density of 10 6 to 10 10 per mm 2 , and a precipitate Y having a diameter of 50 to 500 nm and a density of 10 4 to 10 8 per mm 2 ; and a method of producing the copper alloy, including the steps of: cold-working the recrystallized structure with an average crystal grain diameter of 1 to 15 µm at a working ratio of 40 to 70%; and heating the resultant to obtain a recrystallized structure with a crystal grain diameter of 1 to 2 µm.

Description

technical field [0001] The present invention relates to a copper alloy for electrical and electronic equipment having excellent strength and bending workability suitable for connectors or terminals used in electrical and electronic equipment or wiring in automobiles, and to a method for producing the same. Background technique [0002] In recent years, there have been increasing demands for miniaturization, weight reduction, and high-density mounting of electrical and electronic equipment and wiring in automobiles. If miniaturization is promoted, the contact area of ​​the contact part will decrease, and the thickness of the plate used will also become thinner. In order to maintain the same reliability as the conventional one, a high-strength material is required. Materials used in electronic components such as connectors and terminals are urgently required to have high strength and excellent bending workability. In order to increase the strength of metal materials, not only...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C22C9/02C22F1/08H01L23/48C22F1/00
CPCH01L2924/0002H01L23/49579C22F1/08C22C9/02H01R13/03H01L2924/00
Inventor 金子洋三原邦照江口立彦
Owner FURUKAWA ELECTRIC CO LTD
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