251results about How to "Excellent bending workability" patented technology

This invention provides a copper alloy sheet material containing, in mass %, Ni: 0.7%-4.2% and Si: 0.2%-1.0%, optionally containing one or more of Sn: 1.2% or less, Zn: 2.0% or less, Mg: 1.0% or less, and Co: 2.0% or less, and a total of 3% or less of one or more of Cr, B, P, Zr, Ti, Mn and V, the balance being substantially Cu, and having a crystal orientation satisfying Expression (1): I{420} / I0{420}>1.0, (1) where I{420} is the x-ray diffraction intensity from the {420} crystal plane in the sheet plane of the copper alloy sheet material and I0{420} is the x-ray diffraction intensity from the {420} crystal plane of standard pure copper powder. The copper alloy sheet material has highly improved strength, post-notching bending workability, and stress relaxation resistance property.

A coated steel sheet which is excellent in bending properties, press working properties, tight adhesion of coating film after working, solvent resistance, chemical resistance, stain resistance, weather resistance, electrical conductivity and corrosion resistance and which has excellent surface appearance and satisfactory hardness of coating film, more specifically, a steel sheet which is characterized in that the both sides of the sheet are each covered with a zinc plating layer and a chromium-free chemical conversion coating formed successively and the chemical conversion coating on either of the sides of the sheet is further covered with a single coating film comprising both a polyester resin cured with a crosslinking agent and resin particles having a mean particle diameter of 3 to 40[mu]m, a glass transition temperature of 70 to 200 DEG C and a hardness higher than that of the polyester resin.

This invention is a copper-based alloy for use in connectors, lead frames, switches and relays and the like that has a superior balance of conductivity, tensile strength and workability in bending and method of manufacturing same. The alloy is manufactured by taking an ingot of a copper-based alloy containing Ni, Sn, P and also at least one or more elements selected from a group consisting of Zn, Si, Fe, Co, Mg, Ti, Cr, Zr and Al in a total amount of 0.01-30 wt. % with the remainder being Cu and unavoidable impurities, performing a combination process of cold rolling followed by annealing at least one time and then performing cold rolling at a percent reduction Z that satisfies the following Formula (1):Z<100−10X−Y   (1)[where Z is the percent cold reduction (%), X is the Sn content (wt. %) among the various elements, and Y is the total content (wt. %) of all elements other than Sn and Cu] followed by low-temperature annealing performed at a temperature below the recrystallization temperature. This causes dispersion and precipitation of Ni—P compounds so that a precipitation-strengthened type copper-based alloy with an x-ray diffraction intensity ratio of the surface SND as given by the following formula is 0.05≦SND≦0.15 [provided that SND=I{200}÷[I{111}+I{220}+I{311}], where I{200} is the x-ray diffraction intensity of the {100} plane, I{111} is the x-ray diffraction intensity of the {111} plane, I{220} is the x-ray diffraction intensity of the {110} plane, and I{311} is the x-ray diffraction intensity of the {311} plane] and a superior balance of conductivity, tensile strength, 0.2% yield strength, springiness, Vickers hardness and bending workability is obtained.

The present invention provides a copper alloy material for electrical components that is excellent in strength, yield strength, elongation, and electrical conductivity, and has good bending performance. The copper alloy contains (mass %) 1.0-5.0% Ni, 0.2-1.0% Si, 0.05-2.0% Sn, 0.1-5.0% Zn, 0.01-0.3% P, and a total of 0.05-1.0% selected from Fe and Co. At least one, the balance is Cu and unavoidable impurities, the ratio of the total mass of Ni, Fe and Co to the total mass of Si and P is 4 to 10, and the tensile strength is greater than or equal to 700N / mm2, The elongation is greater than or equal to 10%, and the electrical conductivity is greater than or equal to 40% IACS. The manufacturing method includes: the first cold rolling process, after forming the copper alloy raw material, cold rolling the copper alloy raw material to a thickness of 1.1 to 1.3 times the target final plate thickness; the first heat treatment process, heating the first cold rolled material to After 700-850°C, cool down to below 300°C at a rate of above 25°C per minute; the second cold rolling process, cold-roll the material after the first heat treatment to the target final plate thickness; the second heat treatment process, the second cold The rolled material is heated to 400-500° C. and kept for 30 minutes to 3 hours.

The invention discloses a copper alloy with an outstanding comprehensive performance. The copper alloy comprises the following components in percentage by weight: 0.4-2.0% of Ni, 0.2-2.5% of Sn, 0.02-0.25% of P, 0.001-0.5% of Si, and the balance Cu and inevitable impurities. The yield strength of the copper alloy is not less than 550MPa; the conductivity of the copper alloy is not less than 38% IACS; the bending processing performance meets that the R / t in GW direction is not greater than 1, and the R / t in BW direction is not greater than 2; the stress residue rate is not less than 75% after the copper alloy is subjected to temperature maintaining for 1000h under the temperature of 150 DEG C, so that the stress release resistance is outstanding. The alloy can be processed into slab strips,bars, wires, etc. based on different application demands; and the alloy can be widely applied to connectors such as electrical apparatus, automobile and communication apparatus, or terminals or switch parts.