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246results about How to "Excellent bending workability" patented technology

Copper alloy, copper alloy plate, and process for producing the same

ActiveCN101171349AImprove featuresImprove stress relaxation resistanceElectrolysisFiltration
This invention provides a copper alloy having excellent stress relaxation resistance, comprising Ni: 0.1 to 3.0% (% by mass; the same shall apply hereinafter), Sn: 0.01 to 3.0%, and P: 0.01 to 0.3% with the balance consisting of copper and unavoidable impurities, characterized in that the content of Ni in an extraction residue after extraction separation on a filter having an opening size of 0.1 [mu]m by an extraction residue method is not more than 40% in terms of the proportion to the content of Ni in the copper alloy. In the extraction residue method, 10 g of the copper alloy is immersed in 300 ml of a methanol solution having an ammonium acetate concentration of 10% by mass. This copper alloy is used as an anode. On the other hand, platinum is used as a cathode. Galvanostatic electrolysis is carried out at a current density of 10 mA/cm<2>. A solution containing this copper alloy dissolved therein is subjected to suction filtration by a polycarbonate membrane filter having an opening size of 0.1 [mu]m, and the insolubles as the residue are separated and extracted on the filter. The content of Ni in the extraction residue is determined by dissolving the insolubles as the residue on the filter in a solution composed of a mixture of aqua regia and water at a ratio of 1 : 1, and then analyzing the solution by ICP emission spectrometry.
Owner:KOBE STEEL LTD

Copper-based alloy and method of manufacturing same

This invention is a copper-based alloy for use in connectors, lead frames, switches and relays and the like that has a superior balance of conductivity, tensile strength and workability in bending and method of manufacturing same. The alloy is manufactured by taking an ingot of a copper-based alloy containing Ni, Sn, P and also at least one or more elements selected from a group consisting of Zn, Si, Fe, Co, Mg, Ti, Cr, Zr and Al in a total amount of 0.01-30 wt. % with the remainder being Cu and unavoidable impurities, performing a combination process of cold rolling followed by annealing at least one time and then performing cold rolling at a percent reduction Z that satisfies the following Formula (1):
Z<100−10X−Y  (1)
[where Z is the percent cold reduction (%), X is the Sn content (wt. %) among the various elements, and Y is the total content (wt. %) of all elements other than Sn and Cu] followed by low-temperature annealing performed at a temperature below the recrystallization temperature. This causes dispersion and precipitation of Ni—P compounds so that a precipitation-strengthened type copper-based alloy with an x-ray diffraction intensity ratio of the surface SND as given by the following formula is 0.05≦SND≦0.15 [provided that SND=I{200}÷[I{111}+I{220}+I{311}], where I{200} is the x-ray diffraction intensity of the {100} plane, {111} is the x-ray diffraction intensity of the {111} plane, I{220} is the x-ray diffraction intensity of the {110} plane, and {311} is the x-ray diffraction intensity of the {311} plane] and a superior balance of conductivity, tensile strength, 0.2% yield strength, springiness, Vickers hardness and bending workability is obtained.
Owner:DOWA METALTECH CO LTD

Copper-based alloy and method of manufacturing same

This invention is a copper-based alloy for use in connectors, lead frames, switches and relays and the like that has a superior balance of conductivity, tensile strength and workability in bending and method of manufacturing same. The alloy is manufactured by taking an ingot of a copper-based alloy containing Ni, Sn, P and also at least one or more elements selected from a group consisting of Zn, Si, Fe, Co, Mg, Ti, Cr, Zr and Al in a total amount of 0.01-30 wt. % with the remainder being Cu and unavoidable impurities, performing a combination process of cold rolling followed by annealing at least one time and then performing cold rolling at a percent reduction Z that satisfies the following Formula (1):Z<100−10X−Y   (1)[where Z is the percent cold reduction (%), X is the Sn content (wt. %) among the various elements, and Y is the total content (wt. %) of all elements other than Sn and Cu] followed by low-temperature annealing performed at a temperature below the recrystallization temperature. This causes dispersion and precipitation of Ni—P compounds so that a precipitation-strengthened type copper-based alloy with an x-ray diffraction intensity ratio of the surface SND as given by the following formula is 0.05≦SND≦0.15 [provided that SND=I{200}÷[I{111}+I{220}+I{311}], where I{200} is the x-ray diffraction intensity of the {100} plane, I{111} is the x-ray diffraction intensity of the {111} plane, I{220} is the x-ray diffraction intensity of the {110} plane, and I{311} is the x-ray diffraction intensity of the {311} plane] and a superior balance of conductivity, tensile strength, 0.2% yield strength, springiness, Vickers hardness and bending workability is obtained.
Owner:DOWA METALTECH CO LTD

Copper alloy material for electric element and method of making same

The present invention provides a copper alloy material for electrical components that is excellent in strength, yield strength, elongation, and electrical conductivity, and has good bending performance. The copper alloy contains (mass %) 1.0-5.0% Ni, 0.2-1.0% Si, 0.05-2.0% Sn, 0.1-5.0% Zn, 0.01-0.3% P, and a total of 0.05-1.0% selected from Fe and Co. At least one, the balance is Cu and unavoidable impurities, the ratio of the total mass of Ni, Fe and Co to the total mass of Si and P is 4 to 10, and the tensile strength is greater than or equal to 700N / mm2, The elongation is greater than or equal to 10%, and the electrical conductivity is greater than or equal to 40% IACS. The manufacturing method includes: the first cold rolling process, after forming the copper alloy raw material, cold rolling the copper alloy raw material to a thickness of 1.1 to 1.3 times the target final plate thickness; the first heat treatment process, heating the first cold rolled material to After 700-850°C, cool down to below 300°C at a rate of above 25°C per minute; the second cold rolling process, cold-roll the material after the first heat treatment to the target final plate thickness; the second heat treatment process, the second cold The rolled material is heated to 400-500° C. and kept for 30 minutes to 3 hours.
Owner:株式会社日立金属新材料

Copper alloy material and manufacturing method thereof

Provided is a copper alloy material having excellent bendability, proof strength, conductivity, and stress relaxation resistance, and that is suitable for automotive components and the surrounding infrastructure, particularly in electric vehicles and hybrid electric vehicles, as well as for the lead frames, connectors, terminals, etc. of solar power generation systems and the like. The copper alloy material contains 0.1-0.8 mass% of Cr and 0.01-0.5 mass% in total of at least one type selected from the group consisting of additive element group 1 and additive element group 2, and the remainder comprises copper and inevitable impurities. In the crystal orientation analysis of a rolled surface carried out using electron backscatter diffraction measurement, the area proportion of crystal grains having an orientation that is offset at 15 DEG or less from the cube orientation {001}<100>; is 3% or above, and the proportion of S3 coincidence grain boundaries in the crystal grain boundaries is 20% or above.The additive element group 1 is 0.01-0.5 mass% in total of at least one type selected from the group consisting of Mg, Ti, and Zr; and additive element group 2 is 0.005-0.5 mass% in total of at least one type selected from the group consisting of Zn, Fe, Sn, Ag, Si, and P.
Owner:FURUKAWA ELECTRIC CO LTD

Uniform cooling fin and production method thereof

The invention discloses a uniform cooling fin, and further discloses a production method of the uniform cooling fin. The production method includes preparing a high thermal-conducting metal sheet and low thermal-conducting viscose; evenly coating a surface of the high thermal-conducting metal sheet with the low thermal-conducting viscose; and then roasting and foaming to form a uniform cooling fin. The uniform cooling fin is clever and reasonable in structure design with creative combination of the high thermal-conducting metal sheet and the low thermal-conducting viscose. On the basis of guaranteeing quick heat dissipation, the hotpoint areas are eliminated to guarantee comfort in use. The uniform cooling fin is also better in bending work property, convenient to process into optional sizes, shapes and structure, and wide in application range. Affection on appearance and use caused by cracking and breaking conventional graphite fins is avoided effectively and product quality is guaranteed. By the production method, the uniform cooling fin can be produced quickly, producing period is reduced greatly, and producing efficiency is improved. The whole procedure is compact, easy to realize and low in cost; and quality of products is guaranteed efficiently.
Owner:HENGSHAN JIACHENG NEW MATERIAL
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