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Copper alloy sheet and method for producing same

A manufacturing method, copper alloy technology, applied in the direction of metal/alloy conductors, conductive materials, conductive materials, etc., can solve the problem of insufficient improvement of bendability, etc., and achieve the effect of excellent bending workability and excellent strength

Inactive Publication Date: 2013-05-01
FURUKAWA ELECTRIC CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

In addition, in the invention described in Patent Document 3, the crystal orientation is controlled by reducing the calendering rate after the solution heat treatment, but in this case, the effect of improving the bendability may not be sufficient.

Method used

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  • Copper alloy sheet and method for producing same
  • Copper alloy sheet and method for producing same
  • Copper alloy sheet and method for producing same

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Embodiment

[0117] Hereinafter, the present invention will be described in more detail based on examples, but the present invention is not limited to these examples.

[0118] (Example and comparative example)

[0119] The raw material is melted in a high-frequency melting furnace, and cast at a cooling rate of 0.1° C. / sec to 100° C. / sec [step 1] to obtain an ingot. The analysis components are shown in Tables 1 to 4, and the balance is composed of Cu and unavoidable impurities. After homogenizing the ingot at a temperature of 900 to 1020°C for 3 minutes to 10 hours [Process 2], heat working [Process 3], and then water quenching (equivalent to water cooling [Process 4] ), and surface cutting [Process 5] was performed to remove scale. Thereafter, cold rolling 1 [step 6], heat treatment 1 [step 7], cold rolling 2 [step 8], and heat treatment 2 [step 9] were performed under the conditions shown in A to D in Table 5. After that, aging precipitation heat treatment at 400°C to 700°C for 5 minu...

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Abstract

{Problems} To provide a copper alloy sheet material, excellent in bending property and mechanical strength, and suitable for lead frames, connectors, terminal materials, and the like in electrical / electronic equipments, for connectors, for example, to be mounted on automotive vehicles, and for terminal materials, relays, switches, and the like; and to provide a method of producing the same. {Means to solve} A copper alloy sheet material, containing at least one of Cr, Zr, and Ti in an amount of 0.05 to 1.0 mass% in total, with the balance being copper and unavoidable impurities, wherein an area ratio of Cube orientation {0 0 1} <1 0 0> is 5% or more and 70% or less, in crystal orientation analysis by an EBSD analysis, and wherein a Vickers hardness is 120 or more; and a method of producing the same.

Description

technical field [0001] The present invention relates to a copper alloy sheet material and a method for producing the same. Specifically, the present invention relates to a copper alloy suitable for automotive components such as lead frames, connectors, terminal materials, relays, switches, sockets, and engines, or components for electrical and electronic equipment. Plates and methods for their manufacture. Background technique [0002] Conductivity, endurance (yielding stress), tensile strength, and bending workability are required for copper alloy sheets used for automotive parts or electrical and electronic equipment such as lead frames, connectors, terminal materials, relays, switches, and sockets and stress relaxation resistance. In recent years, with the miniaturization, weight reduction, high performance, high-density mounting, and high temperature of the use environment of electrical and electronic equipment, the level required for these components is increasing. ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C22C9/00C22C9/01C22C9/02C22C9/04C22C9/05C22C9/06C22C9/10C22F1/08H01B1/02C22F1/00
CPCC22C9/06H01B1/026C22C9/00C22C1/02C22C9/01C22C9/02C22F1/08C21D2201/05C22C9/04Y02P10/20
Inventor 金子洋佐藤浩二矶松岳己江口立彦
Owner FURUKAWA ELECTRIC CO LTD
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