Uniform cooling fin and production method thereof

Abstract

The invention discloses a uniform cooling fin, and further discloses a production method of the uniform cooling fin. The production method includes preparing a high thermal-conducting metal sheet and low thermal-conducting viscose; evenly coating a surface of the high thermal-conducting metal sheet with the low thermal-conducting viscose; and then roasting and foaming to form a uniform cooling fin. The uniform cooling fin is clever and reasonable in structure design with creative combination of the high thermal-conducting metal sheet and the low thermal-conducting viscose. On the basis of guaranteeing quick heat dissipation, the hotpoint areas are eliminated to guarantee comfort in use. The uniform cooling fin is also better in bending work property, convenient to process into optional sizes, shapes and structure, and wide in application range. Affection on appearance and use caused by cracking and breaking conventional graphite fins is avoided effectively and product quality is guaranteed. By the production method, the uniform cooling fin can be produced quickly, producing period is reduced greatly, and producing efficiency is improved. The whole procedure is compact, easy to realize and low in cost; and quality of products is guaranteed efficiently.

Description

technical field [0001] The invention relates to heat dissipation technology, in particular to a uniform heat dissipation fin and a manufacturing method thereof. Background technique [0002] With the acceleration of the continuous upgrading of electronic products and the increasing of highly integrated and high-performance electronic equipment, the size of working components is getting smaller and smaller, the speed and efficiency of work are getting higher and higher, and the heat generation is getting bigger and bigger. At present, the known metal heat conduction and heat dissipation components have been limited by their materials and their own heat conduction and heat dissipation limits. Advanced heat conduction and heat dissipation technology and excellent heat conduction and heat dissipation materials must be used to effectively remove heat and ensure the effective work of electronic products. [0003] In the prior art, in order to speed up the heat conduction effect, i...

AI Technical Summary

Problems solved by technology

The traditional bonding method is to bond graphite heat sinks with glue. This bonding method is more complicated to operate and requires specific operations during bonding. Due to the fragility and flake peeling characteristics of graphite, it is not only easy to Graphite powder falls off and the bond is not firm. It also greatly slows down the operation speed and reduces production efficiency. Moreover, graphite flakes are prone to deformation or cracking, making it difficult to guarantee product quality.

In addition, sometimes it is necessary to bond metal sheets on the surface of graphite, which also brings problems such as complicated operation and weak bonding.

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