High-strength Cu-Ni-Si alloy and preparation method thereof

A cu-ni-si, high-strength technology, applied in the field of copper alloy materials, can solve the problems of low alloy tensile strength and electrical conductivity, low alloy strength and electrical conductivity, no strength data, etc., to slow down the recrystallization process, The effect of not easy to grain segregation, strength and hardness improvement

Inactive Publication Date: 2014-12-03
HENAN UNIV OF SCI & TECH
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Problems solved by technology

[0003] Chinese patent on April 24, 2012 (publication number CN 102676876A) discloses a high-strength and high-conductivity copper alloy material and its manufacturing method. In this invention, Cr, Al, and Be trace elements are added to the Cu-Ni-Si alloy, and deformation aging treatment is obtained. The tensile strength and electrical conductivity of the alloy are low
Chinese patent on June 5, 2012 (publication number CN 102703754A) discloses a Cu-Ni-Si-based alloy and its preparation method. In this invention, a trace element V is added to the Cu-Ni-Si alloy, and the conductivity of the alloy is relatively high. High, but its hardness is low, and no strength data
The patent applied on March 14, 2012 (publication number CN 103429771A) relates to a Cu-Ni-Si alloy strip with excellent bending workability, in which the contents of Ni and Si are 1.0-4.5% and 0.2-1.0%, respectively. The hot workability of the alloy limits the concentration of Si to no more than 1.0%, resulting in low strength and electrical conductivity of the alloy

Method used

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  • High-strength Cu-Ni-Si alloy and preparation method thereof

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Embodiment 1

[0021] A high-strength Cu-Ni-Si alloy composed of the following components by weight percentage: 2.0% Ni, 0.52% Si, 0.53% Ti, 1.0% Mn, 1.0% Ag, and the balance is copper and Unavoidable impurity elements, and Ni is generated inside the alloy 2 Si non-oxide reinforcement phase.

[0022] The preparation method of above-mentioned high strength Cu-Ni-Si alloy is:

[0023] (1) Melting and mold casting: Put the metal raw materials in the above ratio into a high-frequency vacuum melting furnace for melting, and vacuumize until the pressure in the furnace is 5×10 -2 Pa, and then fill the furnace with argon until the pressure in the furnace is 0.05MPa. The melting sequence is: add electrolytic nickel, silicon and part of copper → bake the material at 100 ° C for 15 minutes → heat up to melt copper, nickel, silicon → 1000 ° C Refining at low temperature for 10 minutes→increase the power and add titanium, manganese, silver (titanium, manganese and silver are all added in the form of an...

Embodiment 2

[0030] A high-strength Cu-Ni-Si alloy composed of the following components by weight percentage: 2.5% Ni, 0.6% Si, 1.0% Ti, 0.7% Ag, 0.9% Mn, and the balance is copper and Unavoidable impurity elements, and Ni is generated inside the alloy 2 Si non-oxide reinforcement phase.

[0031] The preparation method of above-mentioned high strength Cu-Ni-Si alloy is:

[0032] (1) Melting and mold casting: Put the metal raw materials in the above ratio into a high-frequency vacuum melting furnace for melting, and vacuumize until the pressure in the furnace is 5×10 -2 Pa, then fill the furnace with argon until the pressure in the furnace is 0.05MPa, the melting sequence is: add electrolytic Ni, Si and part of Cu → bake the material at 100°C for 15min → heat up to melt copper, nickel, silicon → 1000°C Refining at low temperature for 10min→increase the power and add Ti, Mn, Ag and the remaining Cu in the form of Ti-Cu, Mn-Cu and Ag-Cu master alloy→transmit electricity and raise the temper...

Embodiment 3

[0039] A high-strength Cu-Ni-Si alloy composed of the following components by weight percentage: 2.5% Ni, 0.6% Si, 1.0% Ti, 0.7% Ag, 0.9% Mn, and the balance is copper and Unavoidable impurity elements, and Ni is generated inside the alloy 2 Si non-oxide reinforcement phase.

[0040] The preparation method of above-mentioned high strength Cu-Ni-Si alloy is:

[0041] (1) Refer to Example 2 for the smelting and casting mold preparation process; wherein, the smelting temperature is controlled at 1280°C during smelting, and the casting temperature is controlled at 1180°C;

[0042] (2) Homogenization treatment: heat the cast ingot obtained in step (1) to 990°C and keep it warm for 4 hours for homogenization annealing treatment;

[0043] (3) Hot-rolling deformation treatment: heat the ingot obtained in step (2) to 950°C, keep it warm for 10 minutes, and perform hot-rolling deformation treatment, and the hot-rolling rate is controlled at 0.1s -1 , 60% hot-rolled deformation, to ob...

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Abstract

The invention relates to a high-strength Cu-Ni-Si alloy and preparation method thereof. The alloy comprises 2.0-6.0% of Ni, 0.5-1.5% Si, 0.5-1.0% of Ti, 0.5-1.0% of Mn, 0.5-1.0% of Ag and the balance of copper and unavoidable impurity elements. The preparation method sequentially comprises the following steps of smelting; casting; homogenization treatment; hot rolling and solution treatment; pre-cold rolling and aging treatment; and cold-rolling deformation. A Ni2Si non-oxide reinforcing phase is generated in the alloy disclosed by the invention; after the rolling is carried out repeatedly, the nucleation positions of precipitated phases can be increased, the more the broken grains, the more grain boundaries, the more nucleation positions of the precipitated phases and the more the precipitated phases; and under the condition that aging treatment is carried out repeatedly, the more precipitated phases are precipitated and thus the comprehensive performance of the alloy is dramatically increased, the strength, the elongation property at a high temperature and the electric conductivity are improved and the bending workability of the alloy is also improved.

Description

technical field [0001] The invention relates to the technical field of copper alloy materials, in particular to a high-strength Cu-Ni-Si alloy and a preparation method thereof. Background technique [0002] Cu-Ni-Si alloys are a class of alloys with high electrical conductivity that are widely used. At present, they are widely used in lead frames for large-scale integrated circuits, contact wires for trams and electric locomotives, commutators for electric tools, and molds for continuous casting machines. Lining and other fields. With the continuous development of the IT industry around the world, integrated circuits composed of chips and lead frames occupy the core position in electronic information technology, thus putting forward higher requirements for the performance of lead frame copper alloys for large-scale integrated circuits. [0003] Chinese patent on April 24, 2012 (publication number CN 102676876A) discloses a high-strength and high-conductivity copper alloy ma...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C22C9/06C22C1/03C22F1/08
Inventor 张毅周洪雷刘勇柴哲许倩倩孙慧丽龙永强
Owner HENAN UNIV OF SCI & TECH
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