Copper alloy material for electric element and method of making same

Abstract

The present invention provides a copper alloy material for electrical components that is excellent in strength, yield strength, elongation, and electrical conductivity, and has good bending performance. The copper alloy contains (mass %) 1.0-5.0% Ni, 0.2-1.0% Si, 0.05-2.0% Sn, 0.1-5.0% Zn, 0.01-0.3% P, and a total of 0.05-1.0% selected from Fe and Co. At least one, the balance is Cu and unavoidable impurities, the ratio of the total mass of Ni, Fe and Co to the total mass of Si and P is 4 to 10, and the tensile strength is greater than or equal to 700N / mm2, The elongation is greater than or equal to 10%, and the electrical conductivity is greater than or equal to 40% IACS. The manufacturing method includes: the first cold rolling process, after forming the copper alloy raw material, cold rolling the copper alloy raw material to a thickness of 1.1 to 1.3 times the target final plate thickness; the first heat treatment process, heating the first cold rolled material to After 700-850°C, cool down to below 300°C at a rate of above 25°C per minute; the second cold rolling process, cold-roll the material after the first heat treatment to the target final plate thickness; the second heat treatment process, the second cold The rolled material is heated to 400-500° C. and kept for 30 minutes to 3 hours.

Description

technical field [0001] The present invention relates to a copper alloy material for electrical components such as terminals, connectors, and lead frames, and a manufacturing method thereof, and particularly relates to a copper alloy material for electrical components that is excellent in tensile strength, 0.2% yield strength, elongation, conductivity, and good bending workability Copper alloy material and manufacturing method thereof. Background technique [0002] In recent years, electronic devices such as mobile phones and notebook personal computers have been reduced in size, thickness and weight, and components such as terminals and connectors used have smaller electrical components with narrower electrode pitches. Moreover, the lead frame is also developing towards smaller size and thinner wall. [0003] Due to such miniaturization, the materials used also become thinner, but from the point of view that the reliability of the connection must be maintained, although the...

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Problems solved by technology

However, phosphor bronze does not sufficiently satisfy the performance required for the above-mentioned connector materials

For example, since the conductivity of phosphor bronze is as low as about 20% IACS, it cannot adapt to the increase of current (because the increase of Joule heat is significant), and there is also the disadvantage of poor migration resistance.

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