Resin composition and use of the same

A resin composition, thermoplastic resin technology, applied in the field of molded products, can solve the problems of thermal conductivity anisotropy, insufficient heat radiation of components, etc., and achieve the effect of small thermal conductivity

Inactive Publication Date: 2009-10-07
SUMITOMO CHEM CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, when the resin composition disclosed in the above patent document is used, there is a tendency that the resulting molded article may have anisotropy in thermal conductivity
When these molded products are applied in electrical and electronic components, the heat radiation of the components may be easily insufficient

Method used

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  • Resin composition and use of the same
  • Resin composition and use of the same
  • Resin composition and use of the same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0102] The invention is illustrated by using the following examples, but the invention is not limited to these examples.

[0103] The alumina fine particles as component (B) used here are as follows.

[0104] Alumina fine particles (Low Soda Sumitomo fine particles ALM-41-01 produced by Sumitomo Chemical Co., Ltd.).

[0105] Volume-average particle size: 1.7μm

[0106] (It has a bimodal particle size distribution with two maxima in the range of 1.0-2.0 μm in terms of volume-average particle size and in the range of 0.2-0.4 μm in terms of volume-average particle size maximum value within ).

[0107] BET specific surface area 1.2m 2 / g.

[0108] The platy filler used here as component (C) is as follows.

[0109] Talc (Talc X50 manufactured by Nippon Talc Co., Ltd.; volume-average particle diameter of major axis: 17.4 μm, BET specific surface area: 2.64 m 2 / g).

[0110] The glass fibers used here as component (D) are as follows.

[0111] Glass fiber 1 (chopped glass fibe...

preparation Embodiment 1

[0113] In a reactor equipped with a stirrer, torque meter, nitrogen introduction tube, thermometer and reflux condenser, add 994.5g (7.2mol) of p-hydroxybenzoic acid, 446.9g (2.4mol) of 4,4'-dihydroxybiphenyl , 299.0 g (1.8 mol) terephthalic acid, 99.7 g (0.6 mol) isophthalic acid and 1347.6 g (13.2 mol) acetic anhydride. After the gas in the reactor was completely replaced with nitrogen, the temperature inside the reactor was raised to 150° C. during 30 minutes under a nitrogen atmosphere, and then the mixture was refluxed for 1 hour while maintaining the same temperature.

[0114] The temperature was raised to 320° C. during 2 hours and 50 minutes while distilling off acetic acid and unreacted acetic anhydride produced as by-products. After the reaction was complete, an increase in torque was observed, resulting in a prepolymer.

[0115] The prepolymer thus obtained was cooled to room temperature, ground with a coarse grinder, and then heated by raising the temperature from...

Embodiment 1-9

[0116] Embodiment 1-9, comparative example 1-4

[0117] According to the composition shown in Table 1, LCP1 obtained in Preparation Example 1, and the above components (B), (C) and (D) were obtained by using a unidirectional twin-screw extruder (by Ikegai Iron PCM-30HS manufactured by Works Ltd.) was granulated by melt-kneading at 330°C. The obtained pellets were molded at a cylinder temperature of 350°C and a molding temperature of 130°C with an injection molding machine (type PS40E5ASE manufactured by Nissei Plastic Industrial Ltd.) at a distance of 30 cm. 3 / s injection rate for injection molding. Two kinds of molded articles each having a different shape were obtained, and then evaluated.

[0118] Molded product 1: 126mm×12mm×6mm;

[0119] Molded product 2: ASTM No.4 dumbbell shape

[0120] Regarding the molded article thus obtained, its specific gravity, thermal conductivity, tensile strength and bending strength were evaluated. The results are given in Table 1. The...

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Abstract

The present invention provides resin composition and use of the same, the resin composition comprising (A) a thermoplastic resin, (B) alumina fine particles and (C) a plate-like filler, wherein the component (B) is contained in the larger amount than the amount of the component (C) in the composition, and the resin composition has a specific volume resistance of 1x1010 Omegam or more.

Description

technical field [0001] The present invention relates to a resin composition providing a molded article having excellent thermal conductivity, and a molded article obtainable by molding the resin composition. Background technique [0002] With the development of miniaturization and high performance in the electric and electronic fields, heat generation in electric and electronic components has recently attracted attention. When thermal radiation control is insufficient to combat heat generation, heat buildup can lead to performance degradation of electrical and electronic components. Therefore, it is considered important to impart high thermal conductivity to components used in electrical and electronic components. [0003] Until now, components requiring high thermal conductivity have mainly used metallic materials. However, from the standpoint consistent with component miniaturization, metal materials are insufficient in light weight and workability. Therefore, metal mat...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L101/00C08L67/00C08L67/04C08L67/03C08K3/22H01B3/42
CPCC08L101/00H01L2924/0002C08K7/00H01L23/31H01L23/29C08L67/00C08L67/04C08K3/22C08L67/03H01B3/42C08K2003/2227H01L2924/00
Inventor 小松晋太郎前田光男原田博史
Owner SUMITOMO CHEM CO LTD
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