Copper alloy material, and method for production thereof

Abstract

A copper alloy material according to the present invention is characterized in that the copper alloy material includes: an element X between 0.1% and 4% by mass, in which the element X represents one transition element or not less than two elements selected from Ni, Fe, Co and Cr; an element Y between 0.01% and 3% by mass, in which the element Y represents one element or not less than two elements selected from Ti, Si, Zr and Hf; and a remaining portion to be comprised of copper and an unavoidable impurity, wherein the copper alloy material has an electrical conductivity of not less than 50% IACS, an yield strength of not less than 600 MPa, and a stress relaxation rate of not higher than 20% as to be measured after the same is maintained for 1000 hours at a state under applying a stress of 80% of the yield strength.

Description

TECHNICAL FIELD

[0001] The present invention relates to a copper alloy material and to a method for production thereof.BACKGROUND ART

[0002] A copper alloy material has been used for applications such as a lead frame, a connector, a terminal material, or the like of an electrical and electronic device, more specifically a connector or a terminal material to be mounted on a motor vehicle, a relay, a switch, a socket, or the like. In the applications, the copper alloy needs to have properties such as an electrical conductivity, an yield strength (an yield stress), a tensile strength, a bending workability and an yield stress relaxation characteristic. Recently, the properties need to be improved further as the demand for a smaller size, a lighter weight, a higher function, a higher package density, or a higher environment temperature of the electrical and electronic device increases.

[0003] Conventionally, a copper-based material such as phosphor bronze, red brass, brass, or the like, in ad...

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