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Copper alloy material, and method for production thereof

a technology of copper alloy and alloy material, applied in the field of copper alloy material, can solve the problems of insufficient electrical conductivity of cu—ni—si based alloy, difficult to obtain sufficient bending workability and yield stress relaxation characteristic, and achieve the effect of improving properties

Inactive Publication Date: 2010-07-08
FURUKAWA ELECTRIC CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

[0009]The present inventors have examined regarding a composition of a copper alloy material, an average crystalline grain diameter thereof, an electrical conductivity property, an yield strength, a stress relaxation characteristic and a bending workability. It is found that it becomes possible to improve the properties by controlling properly individual conditions, thereby achieving the present invention.
[0013]3. According to a third aspect of the present invention, in the copper alloy material in the first or the second aspect, an average crystalline grain diameter is not larger than 10 μm, and it is superior in bending workability.

Problems solved by technology

However, with the technique, it is difficult to obtain sufficient electrical conductivity.
Moreover, the cold working is conducted at a higher processing rate to obtain a higher strength, so that it is difficult to obtain sufficient bending workability and yield stress relaxation characteristic.
However, the Cu—Ni—Si based alloy does not have sufficient electrical conductivity, and it is necessary to improve the electrical conductivity.
When the crystalline grain diameter becomes rough and large, a local transformation in the process of bending work tends to increase, thereby causing a crack or the like.
Furthermore, a wrinkle tends to become large on a surface of a bend section, so that an electric current may be converged, or a plated surface of a material may crack when the bend section is used as a contact.
However, it is difficult to improve the strength, the electrical conductivity, the yield stress relaxation characteristic, and the bending workability together, and it is not to completely meet the demand for all properties.

Method used

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  • Copper alloy material, and method for production thereof
  • Copper alloy material, and method for production thereof

Examples

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Effect test

example 1

[0070]At first there is performed a mixing of the elements X and of the elements Y in order to obtain the content and the composition (mass %) as shown in the following Table 1-1 and Table 1-2. Moreover, there is performed thereafter a dissolution of an alloy by making use of a high frequency melting furnace, in which a remaining portion is comprised of copper and an unavoidable impurity. And hence there is obtained an ingot by casting the same with a cooling rate between 0.1° C. per second and 100° C. per second. Further, there is performed a process of treating with heat for homogenizing the same at between 900° C. and 1050° C. for between a half hour and ten hours. And then thereafter there is performed a process of hot working for the same with a reduction in area of not less than 50% at a processing temperature of not lower than 650° C. A water quenching is performed thereafter, and a facing is performed in order to remove an oxidizing scale.

[0071]Thereafter, the copper alloy m...

example 2

[0078]At first there is performed a mixing of the elements X, the elements Y and of the elements Z in order to obtain the content and the composition as shown in the following Table 2-1 and Table 2-2, in which a remaining portion is comprised of copper and an unavoidable impurity. And then thereafter there is performed a production of the copper alloy in accordance with the method for production as similar to that as described in the above mentioned Example 1. Moreover, a part of each of the obtained copper alloy materials thereby is treated as individual sample materials. Further, there are performed the examination on the characteristics thereof as similar to that according to the Example 1. The results are shown in Table 2-1 and Table 2-2.

TABLE 2-1IDENTIFICATIONALLOY CONTENT (mass %)YSEC %SRNUMBERELEMENT XELEMENT YELEMENT ZPROCESSMPaIACS%PRESENT INVENTION2.02Ni0.60Ti0.11Mg, 0.15Sn,A71551.213.2SAMPLE 2-10.31ZnPRESENT INVENTION1.75Fe0.75Ti0.10Mg, 0.22SnA68153.812.4SAMPLE 2-2PRESENT...

example 3

[0080]At first there is performed a mixing of the elements X, the elements Y and of the elements Z in order to obtain the content and the composition as shown in the following Table 3-1 and Table 3-2, in which a remaining portion is comprised of copper and an unavoidable impurity. And then thereafter there is performed a production of the copper alloy in accordance with the method for production as similar to that as described in the above mentioned Example 1. Moreover, a part of each of the obtained copper alloy materials thereby is treated as individual sample materials. Further, there are performed the solution heat treatment for the comparative samples 3-1 to 3-3 at a temperature thereof as approximately between 20° C. and 30° C. higher than that for each of the process of production according to the individual present invention samples 3-1 to 3-3 respectively.

[0081]Still further, there are performed the examination on the characteristics of the average crystalline grain diamete...

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Abstract

A copper alloy material according to the present invention is characterized in that the copper alloy material includes: an element X between 0.1% and 4% by mass, in which the element X represents one transition element or not less than two elements selected from Ni, Fe, Co and Cr; an element Y between 0.01% and 3% by mass, in which the element Y represents one element or not less than two elements selected from Ti, Si, Zr and Hf; and a remaining portion to be comprised of copper and an unavoidable impurity, wherein the copper alloy material has an electrical conductivity of not less than 50% IACS, an yield strength of not less than 600 MPa, and a stress relaxation rate of not higher than 20% as to be measured after the same is maintained for 1000 hours at a state under applying a stress of 80% of the yield strength.

Description

TECHNICAL FIELD[0001]The present invention relates to a copper alloy material and to a method for production thereof.BACKGROUND ART[0002]A copper alloy material has been used for applications such as a lead frame, a connector, a terminal material, or the like of an electrical and electronic device, more specifically a connector or a terminal material to be mounted on a motor vehicle, a relay, a switch, a socket, or the like. In the applications, the copper alloy needs to have properties such as an electrical conductivity, an yield strength (an yield stress), a tensile strength, a bending workability and an yield stress relaxation characteristic. Recently, the properties need to be improved further as the demand for a smaller size, a lighter weight, a higher function, a higher package density, or a higher environment temperature of the electrical and electronic device increases.[0003]Conventionally, a copper-based material such as phosphor bronze, red brass, brass, or the like, in ad...

Claims

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Application Information

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Patent Type & Authority Applications(United States)
IPC IPC(8): C22F1/08C22C9/00C22C9/02C22C9/04C22C9/06C22C9/10
CPCC22C9/00C22C9/06C22F1/08
Inventor KANEKO, HIROSHIMIHARA, KUNITERUEGUCHI, TATSUHIKO
Owner FURUKAWA ELECTRIC CO LTD
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