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Microphone structure and forming method thereof

A technology of microphone and capacitor structure, which is applied to electrostatic transducer microphones, sensors, electrical components, etc. It can solve the problems of further improvement in sensitivity and poor sensitivity of micro-electromechanical microphones, and achieve the effect of increased sensitivity and small space area

Active Publication Date: 2016-03-23
SEMICON MFG INT (SHANGHAI) CORP
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  • Abstract
  • Description
  • Claims
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Problems solved by technology

[0005] However, the sensitivity of the existing micro-electromechanical microphones is poor, and its sensitivity needs to be further improved

Method used

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  • Microphone structure and forming method thereof
  • Microphone structure and forming method thereof

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Experimental program
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Embodiment Construction

[0040] As mentioned in the background, the sensitivity of existing micro-electromechanical microphones is poor.

[0041] After research, it is found that for the MEMS microphone, please continue to refer to figure 1 , the more air the diaphragm 110 contacts, the higher the sensitivity of the MEMS microphone. Specifically, the more sound waves received by the diaphragm 110, the more severe the distance between the diaphragm 110 and the back plate 120 changes, that is, the capacitance of the capacitive structure formed by the diaphragm 110 and the back plate 120 The more drastic the value change, the higher the electrical signal strength output by the microelectromechanical microphone, that is, the higher the sensitivity.

[0042] In order to increase the amount of air that the diaphragm contacts, one method is to increase the area of ​​the diaphragm 110 exposed by the back cavity 140, however, increasing the area of ​​the diaphragm 110 exposed at the bottom of the back cavity ...

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Abstract

The invention provides a microphone structure and a forming method thereof. The microphone structure comprises the components of a substrate which is provided with a first surface and a second surface that faces the first surface; a capacitor structure which is arranged at the first surface of the substrate; and a back chamber which is arranged in the substrate, wherein the top of the back chamber is exposed from the second surface of the substrate, and the capacitor structure is exposed from the bottom of the back chamber. The back chamber comprises a first opening on the surface of the capacitor structure, and a second opening on the top of the first opening. The first opening is exposed from the bottom of the second opening. Furthermore the top dimension of the second opening is larger than the top dimension and the bottom dimension of the first opening. The microphone structure has improved sensitivity.

Description

technical field [0001] The invention relates to the technical field of semiconductor manufacturing, in particular to a microphone structure and a forming method thereof. Background technique [0002] In recent years, with the rapid development of semiconductor technology, electronic products tend to be designed in the direction of miniaturization and thinning. In products in the field of electroacoustics, microphones are used to convert sound waves into electrical signals, and many electronic products currently available on the market are equipped with micro-electromechanical (MEMS) microphones. Compared with common electret microphones (ECM), MEMS microphones are more resistant to heat, vibration, and radio frequency interference. Moreover, the micro-electromechanical microphone has a simple manufacturing process and is easy to integrate with other semiconductor devices, which can simplify the production process, reduce production costs, and improve device integration. ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H04R19/04H04R31/00
Inventor 刘炼李卫刚郭亮良郑超
Owner SEMICON MFG INT (SHANGHAI) CORP
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