Method for making through hole of circuit board and circuit board
A manufacturing method and circuit board technology, which is applied in the direction of multi-layer circuit manufacturing, printed circuit components, electrical connection printed components, etc., can solve the problems of circuit board lamination deviation, reduction of qualified rate of circuit board production, etc.
Active Publication Date: 2019-09-06
GUANGZHOU FASTPRINT CIRCUIT TECH +2
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Problems solved by technology
However, since the multilayer circuit board produced by the traditional method needs to be laminated separately for the first multilayer circuit board, the second multilayer circuit board, and the entire board, the problem of circuit board lamination deviation is prone to occur, making the circuit board Decreased yield of board fabrication
Method used
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Embodiment Construction
[0028] Embodiments of the present invention are described in detail below:
[0029] like Figures 1 to 4 As shown, it shows a schematic diagram of the non-conductive through-hole processing process of a circuit board with 11 layers. The manufacturing method of the circuit board through hole described in the embodiment of the present invention comprises the following steps:
[0030] Step S101, processing a multilayer circuit board 10 with a diameter of D on the multilayer circuit board 10 obtained through pressing 1 The through hole 11 (such as figure 1 shown); before the step of pressing the multilayer circuit board 10, it may also include the steps of making inner layer circuit patterns, inner layer AOI inspection and browning.
[0031] Step S102: Reaming the through holes 11 on both sides of the multilayer circuit board 10, so as to enlarge the diameter to D 2 The first reamer 12 is enlarged with a diameter of D 3 The second reaming hole 13 (such as figure 2 shown); w...
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The invention relates to a circuit board through hole manufacturing method and a circuit board. The method comprises the following steps of drilling a through hole with a diameter of D1 on a multilayer circuit board; performing hole expanding processing on the through hole, thereby obtaining a first expanded hole with an expanded diameter of D2 and a second expanded hole with an expanded diameter of D3; performing electroplating on the multilayer circuit board after hole expanding so that a conductive layer is plated on the inside wall of the first expanded hole, the inside wall of the second expanded hole and the inside wall of an area on which hole expanding processing is not performed on the through hole; and after electroplating on the multilayer circuit board is finished, removing the conductive layer which is electroplated on the inside wall of the area on which hole expanding process is not performed on the through hole. According to the circuit board through hole manufacturing method, drilling can be quickly and accurately performed on two surfaces of the circuit board for forming the first expanded hole and the second expanded hole. The inside wall of the area on which hole expanding processing is not performed on the through hole projects out, thereby facilitating removing of the conductive layer which is electroplated on the inside wall of the area on which hole expanding processing is not performed through a drill.
Description
technical field [0001] The invention relates to the technical field of circuit board manufacturing, in particular to a method for manufacturing a through hole of a circuit board and a circuit board. Background technique [0002] With the development of miniaturization of multilayer circuit boards, it is required to design non-conductive through holes in more multilayer circuit boards. A non-conductive through hole means that the middle area of the inner wall of the through hole is not provided with a copper layer, and the two ends of the inner wall of the through hole are respectively laid with conductive layers, so that the non-conductive through hole cannot realize the inner wall of the through hole. The central area is connected to the two end areas of the inner wall of the through hole. Traditionally, the method for making the non-conducting through holes in the multilayer circuit board is: divide the multilayer circuit board into the first multilayer circuit board an...
Claims
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IPC IPC(8): H05K3/42H05K3/46H05K1/11
Inventor 丁宁娃宫立军王剑
Owner GUANGZHOU FASTPRINT CIRCUIT TECH