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A two-chamber double-layer support structure integrating positioning and centring functions

A support structure and centering technology, which is applied in semiconductor/solid-state device manufacturing, electrical components, circuits, etc., can solve the problems of long switching time between atmosphere and vacuum, low equipment production capacity, etc., and achieve simple and reliable structure, low manufacturing cost, Accurate and reliable positioning effect

Inactive Publication Date: 2017-05-03
PIOTECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] In semiconductor equipment, the load chamber is generally divided into two chambers, and each chamber can only transfer wafers one by one, so it takes a long time to switch between atmosphere and vacuum, and the production capacity of the equipment is low

Method used

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  • A two-chamber double-layer support structure integrating positioning and centring functions
  • A two-chamber double-layer support structure integrating positioning and centring functions

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Experimental program
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Embodiment Construction

[0016] Below in conjunction with embodiment, the present invention is further described in detail, but the protection content of the invention is not limited to described embodiment:

[0017] like Figure 1-2 As shown, a two-chamber double-layer support structure integrating positioning and centering functions, the support structure includes a high-level double-layer wafer support 1 and a low-level double-layer wafer support 2; the high-level double-layer wafer support 1. There is a high-level first layer 8 of a wafer support and a high-level second layer 9 of the wafer support. The low-level double-layer wafer support 2 is provided with a low-level first layer 12 of the wafer support and a low-level second layer 13 of the wafer support. ; The wafer support high first layer 8, the wafer support high second layer 9, the wafer support low first layer 12 and the wafer support low second layer 13 are respectively provided with sapphire balls 4 for supporting the wafer, The limiti...

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Abstract

A two-chamber double-layer support structure integrating positioning and centring functions mainly aims to solve problems such as low production power of wafer equipment and large friction coefficients between wafers and support structures. The invention provides the two-chamber double-layer support structure integrating the positioning and centring functions. The support structure has a high-level double-layer wafer support and a low-level double-layer wafer support. The high-level double-layer wafer support is provided with a wafer support high-level first layer and a wafer support high-level second layer. The low-level double-layer wafer support is provided with a wafer support low-level first layer and a wafer support low-level second layer. The two-chamber double-layer support structure of the invention is simple and reliable in structure, convenient to install, low in manufacturing cost, has an automatic positioning function and improves the product yield.

Description

technical field [0001] The invention relates to a two-chamber double-layer support structure integrating positioning and centering functions. Background technique [0002] In semiconductor equipment, the load chamber is generally divided into two chambers, and each chamber can only transfer wafers one by one, so the switching time between atmosphere and vacuum is long, and the production capacity of the equipment is low. In order to realize the transfer function of multiple wafers and save the time of pumping and backfilling, the structure of the wafer holder is one of the key factors to achieve high throughput and accurate positioning. Since there are certain errors in the transfer process of the manipulator, the installation position of the wafer support must not only meet certain precision requirements, but also minimize the contact friction and collision between the wafer support and the support structure, so as to avoid the contact collision process. The particles brou...

Claims

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Application Information

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IPC IPC(8): H01L21/67H01L21/68H01L21/687
CPCH01L21/6719H01L21/68H01L21/68785
Inventor 周仁范川方仕彩廉杰
Owner PIOTECH CO LTD
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