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Manufacturing method for heat active adhesive

A manufacturing method and technology of cover tape, which are applied in film/sheet adhesives, adhesive additives, non-polymer adhesive additives, etc., can solve the problem of wasting glue, unable to accurately grasp electronic components, and wasting resources. And other issues

Inactive Publication Date: 2017-05-10
GUIXI RUOBANG ELECTRONICS SCI & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, not only glue and resources are wasted during the sealing process with the carrier tape, but also the heat-sealing cover tape is not transparent enough due to the glue when packaging the internal electronic components, and the appearance and batch number of the electronic components are inspected through the heat-sealing cover tape after packaging. information
And the heat-sealed cover tape is glued as a whole. After packaging, the glue is in close contact with the electronic components for a long time to form a bond. When patching, it is easy to cause the bad phenomenon of sticking components, which leads to the inability to accurately grasp the electronic components during patching. Instead, the electronic components Components are glued to the heat sealing tape and taken away

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0019] A method of manufacturing a heat-sealing cover tape, comprising the following steps:

[0020] (A) making a version roll provided with equidistant ridges; the width of the ridges and the distance between the two ridges can be set and adjusted according to production needs;

[0021] (B) Prepare glue; Ⅰ) Take out 65 parts by weight of ethylene bis stearamide and 25 parts by weight of resin in proportion to the solvent tank, pour into toluene solvent to dissolve, and pour 10 parts by weight of transparent powder while stirring pneumatically , to reach a solid content of 30%; Ⅱ) After the solvent ratio is completed, use a pneumatic mixer to stir for 5 minutes at 300 rpm; Ⅲ) After stirring for 5 minutes, pour it into the stirring tank, stir at 100 rpm for 2 hours, and then start soaking for 24 hours to make the ethylene bismuth Stearamide, resin, and transparent powder are fully dissolved in the solvent; Ⅳ) After soaking and fully dissolving, a glue-like substance is formed, ...

Embodiment 2

[0025] A method of manufacturing a heat-sealing cover tape, comprising the following steps:

[0026] (A) Prepare glue; Ⅰ) Take out 66 parts by weight of ethylene bis stearamide and 24 parts by weight of resin in proportion to the solvent barrel, pour into toluene solvent to dissolve, and pour 10 parts by weight of transparent powder while stirring pneumatically , to reach a solid content of 30%; Ⅱ) After the solvent ratio is completed, use a pneumatic mixer to stir for 5 minutes at 300 rpm; Ⅲ) After stirring for 5 minutes, pour it into the stirring tank, stir at 100 rpm for 2 hours, and then start soaking for 24 hours to make the ethylene bismuth Stearamide, resin, and transparent powder are fully dissolved in the solvent; Ⅳ) After soaking and fully dissolving, a glue-like substance is formed, and stirred again at 100rpm in the stirring tank for 20 minutes; Ⅴ) After fully stirring, the glue is made, filtered, and used Filter with a 200-mesh filter bag to filter out impurities ...

Embodiment 3

[0031] A method of manufacturing a heat-sealing cover tape, comprising the following steps:

[0032] (A) Prepare glue; Ⅰ) Take out 67 parts by weight of ethylene bis stearamide and 23 parts by weight of resin in proportion to the solvent tank, pour into toluene solvent to dissolve, and pour 10 parts by weight of transparent powder while stirring pneumatically , to reach a solid content of 30%; Ⅱ) After the solvent ratio is completed, use a pneumatic mixer to stir for 5 minutes at 300rpm; Ⅲ) After stirring for 5 minutes, pour it into the stirring tank, stir at 100rpm for 2 hours, and then start soaking for 24 hours to make the ethylene bismuth Stearamide, resin, and transparent powder are fully dissolved in the solvent; Ⅳ) After soaking and fully dissolving, a glue-like substance is formed, and stirred again at 100rpm in the stirring tank for 20 minutes; Ⅴ) After fully stirring, the glue is made, filtered, and used Filter with a 200-mesh filter bag to filter out impurities and ...

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Abstract

The invention relates to a manufacturing method for a heat active adhesive. The manufacturing method comprises the following steps: (A) manufacturing a plate roller provided with convex strips in the equal distance; (B) preparing glue; (C) coating the glue on the PE face of the PET / PE compound original film by the plate roller, drying, and forming a semi-finished product of the heat active adhesive with equal-distance adhesive tapes; and (D) slitting the semi-finished product of the heat active adhesive by a slitting machine, rolling by a rolling machine to obtain a finished product of the heat active adhesive. The heat active adhesive is sealed well by the plate roller coating glue and a carrier band so as to form a closed space. Because other positions of the heat active adhesive which do not need to be sealed are not coated by the glue, the cost and the resources are greatly saved firstly; secondly the transparency after packaging an electronic component is very good, the information, such as the appearance of the electronic component, can be clearly observed; and thirdly, the electronic component and the heat active adhesive are avoided to be adhered together, and the phenomenon of adhering components is solved.

Description

technical field [0001] The invention relates to a heat-sealing cover tape, in particular to a manufacturing method of the heat-sealing cover tape. Background technique [0002] At present, the electronics industry is developing rapidly, and the use of electronic components is increasing day by day. The demand for heat-sealing cover tapes for packaging is increasing. Because the surface of the PET / PE composite film of heat-sealing cover tapes in the existing market is coated with glue, and it is not sealed with the carrier tape. Glue is applied everywhere. Therefore, not only glue and resources are wasted during the sealing process with the carrier tape, but also the heat-sealing cover tape is not transparent enough due to the glue when packaging the internal electronic components, and the appearance and batch number of the electronic components are inspected through the heat-sealing cover tape after packaging. information. And the heat-sealed cover tape is glued as a whole...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08J7/02C09J201/00C09J11/06C08L23/06C08L83/04
CPCC08K5/20C08L23/06C08L2203/162C09J7/29C09J11/06C09J201/00C09J2203/326C09J2301/162C09J2301/312C09J2301/40C09J2423/046C09J2467/006C08L83/04
Inventor 琚美文
Owner GUIXI RUOBANG ELECTRONICS SCI & TECH