A kind of resin composition and its application

Abstract

The invention discloses a resin compositionc which comprises the following components in parts by weight: 10-40 parts of bismaleimide modified epoxy, 20-50 parts of flexible epoxy resin, 5-20 parts of polyvinyl butyral, 5-20 parts of phenoxy resin, 380-520 parts of heat-conductive padding, 5-12 parts of curing agent, 2-5 parts of coupling reagent, 0.05-0.85 part of curing accelerator and 2-6 parts of additives. According to the resin compositionc disclosed by the invention, the bismaleimide modified epoxy is introduced, so that the resin compositionc has excellent heat resistance and voltage resistance, and meanwhile, the flexible epoxy resin, the phenoxy resin, the polyvinyl butyral and the heat-conductive padding are added, so that the novel resin compositionc has excellent flexibility, heat dissipation, insulation, adhesion and heat resistance. A metal copper-clad plate prepared from the resin compositionc disclosed by the invention has the characteristics of high heat conductivity coefficient, high breakdown voltage, high peel strength, high heat resistance, halogen-free flame retardant and excellent flexibility.

Description

technical field [0001] The invention belongs to the field of copper-clad laminates, and in particular relates to a resin composition, and also relates to the application of the resin composition. Background technique [0002] With the continuous development of the LED lighting industry, people have higher and higher requirements for LED viewing. LED lighting with a 3D three-dimensional structure has attracted widespread attention. 3D LED lighting has the characteristics of excellent viewing, uniform illumination, and fast heat dissipation. [0003] 3D LED lighting requires metal-based copper-clad laminates to have excellent heat dissipation, insulation, heat resistance, and adhesive properties on the one hand, and also requires PCB substrates to have good flexibility and plasticity to meet processing needs. In order to improve the heat dissipation of the metal substrate as much as possible, it is often necessary to add a large amount of thermally conductive fillers, but with...

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Problems solved by technology

[0004] Chinese patent with application number 201511016722.7 (application date: 2015.12.29, publication number: CN105623198, publication date: 2016.6.1) prepared by adding thermally conductive fillers to bismaleimide modified epoxy and flexible epoxy resin systems As a heat-conducting metal substrate, although the heat dissipation and heat resistance of the board are excellent, and the flexibility has been improved, the peel strength of the board is only 1.4N / mm at the highest, and cracks will still occur after bending, and the insulating layer has no flame-retardant function

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