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Packaged electronic device with integrated antenna and locking structure

A technology of electronic device and antenna structure, which is applied in the direction of antenna support/installation device, antenna grounding device, antenna grounding switch structure connection, etc., and can solve problems such as not provided

Active Publication Date: 2021-11-26
AMKOR TECH INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0009] However, for larger body devices (e.g., devices with large die pads greater than 4 millimeters (mm) by 4 mm), long tie bar configurations (e.g., with lengths greater than about 3 mm) Existing solutions have not provided satisfactory results for devices with highly utilized die-to-die attach pad wire bonds (commonly known as underbonding), and combinations thereof

Method used

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  • Packaged electronic device with integrated antenna and locking structure
  • Packaged electronic device with integrated antenna and locking structure
  • Packaged electronic device with integrated antenna and locking structure

Examples

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Embodiment Construction

[0059] In some applications, an electronic device, such as a semiconductor die, is enclosed in a plastic package that provides protection from harsh environments and enables The electrical interconnection between components one level below the board (PCB) or motherboard. The components of such a package typically include a conductive substrate such as a metal lead frame, an integrated circuit or semiconductor die, bonding material for attaching the semiconductor die to the lead frame, a bonding material to be placed on the semiconductor die The pads are electrically connected to the interconnect structure of the individual leads of the leadframe, and a hard plastic encapsulating material covers the other components and forms the exterior of the semiconductor package, often referred to as the package body.

[0060] The lead frame is the central support structure of the package and is typically fabricated by chemical etching or mechanically stamping a metal strip. A portion of ...

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Abstract

A packaged electronic device with an integrated antenna and locking structure. A packaged electronic device includes an integrated antenna as part of a conductive lead frame. The conductive lead frame includes a die pad having an elongated conductive beam structure configured as a transmission line; and a ground plane structure disposed around the die pad. The ground plane includes a gap where the transmission line extends to an edge of the packaged electronic device. In one embodiment, selected leads within the lead frame are configured with conductive connection structures to serve as ground pins, feed pins and / or waveguides. In an alternative embodiment, a portion of the integrated antenna is embedded within the body of the packaged electronic device and is partially exposed.

Description

technical field [0001] The present invention relates generally to electronic devices, and more particularly to packaged electronic structures and methods of forming electronic structures. [0002] Cross-references to related applications: [0003] This application is claiming priority to U.S. Patent Application Serial No. 14 / 931,750, filed November 3, 2015, entitled "Packaged Electronic Devices With Integrated Antenna and Locking Structure," which is the subject of is hereby incorporated by reference in its entirety. Background technique [0004] The market for wireless and portable handheld communication applications is an example of a market that continues to grow and evolve, with greater efforts to integrate more electronic functions into smaller, lighter, thinner and lower-cost solutions. One of the ongoing challenges for these applications is to improve and integrate efficient antennas into various product platforms. Several approaches have been developed and impleme...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/31H01L23/66H01L23/495H01Q1/22H01Q1/36H01Q1/50
CPCH01L23/3121H01L23/4952H01L23/66H01Q1/2283H01Q1/36H01Q1/50H01Q1/38H01Q1/48H01L2924/181H01L2224/05554H01L2224/32245H01L2224/48137H01L2224/48247H01L2224/48257H01L2224/49171H01L2224/73265H01L2924/19107H01L2223/6677H01Q9/0407H01L2924/00012H01L2924/00H01L23/31H01L23/498H01L23/49541H01L2224/48091H01Q1/1292H01Q13/106H01Q9/0421
Inventor 马可艾伦·马翰伦邱黄俊金本俊金吉均贝俊明金孙明李扬吉
Owner AMKOR TECH INC