Blue light LED epitaxial structure grown on GaAs substrate
An epitaxial structure and substrate technology, applied in the direction of electrical components, circuits, semiconductor devices, etc., can solve the problems of small cost reduction, low P-type doping concentration, and difficult manufacturing process, so as to reduce the degree of lattice matching, High P-type doping concentration, the effect of improving recombination efficiency
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Embodiment 1
[0020] (1) First, the epitaxial structure is prepared by baking at a high temperature in an MOCVD reactor to remove residual impurities on the surface of the GaAs substrate 1 .
[0021] (2) Adjust the temperature to 500° C. on the GaAs substrate 1 to grow a ZnO buffer layer 21 with a growth thickness of 5 nm.
[0022] (3) An AlN buffer layer 22 is grown on the ZnO buffer layer 21 at a temperature of 500° and a growth thickness of 5 nm.
[0023] (4) A U1-type GaN layer 31 is grown on the AlN buffer layer 22 , and the temperature is adjusted to 900° C. to grow the U1-type GaN layer 31 for about 10 minutes with a thickness of 1 μm.
[0024] (5) A superlattice GaN / AlGaN Bragg reflection layer 33 is grown on the U1-type GaN layer 31 with a period number of 3, wherein the thickness of GaN is 1 nm, the thickness of AlGaN is 1 nm, the growth temperature is 900 degrees, and the Al composition of AlGaN is 0.6.
[0025] (6) A U2-type GaN layer 32 is grown on the superlattice GaN / AlGaN ...
Embodiment 2
[0027] (1) First, the epitaxial structure is prepared by baking at a high temperature in an MOCVD reactor to remove residual impurities on the surface of the GaAs substrate 1 .
[0028] (2) Adjust the temperature to 600° C. on the GaAs substrate 1 to grow a layer of ZnO buffer layer 21 with a growth thickness of 10 nm.
[0029] (3) An AlN buffer layer 22 is grown on the ZnO buffer layer 21 at a temperature of 600° and a growth thickness of 10 nm.
[0030] (4) A U1-type GaN layer 31 is grown on the AlN buffer layer 22 , and the temperature is adjusted to 1000° C. to grow the U1-type GaN layer 31 for about 20 minutes with a thickness of 2 μm.
[0031] (5) Superlattice GaN / AlGaN Bragg reflection layer 33 is grown on the U1-type GaN layer 31 with a period number of 3, in which the thickness of GaN is 2nm, the thickness of AlGaN is 2nm, the growth temperature is 1000 degrees, and the Al composition of AlGaN is 0.4.
[0032] (6) A U2-type GaN layer 32 is grown on the superlattice ...
Embodiment 3
[0034] (1) First, the epitaxial structure is prepared by baking at a high temperature in an MOCVD reactor to remove residual impurities on the surface of the GaAs substrate 1 .
[0035] (2) Adjust the temperature to 600° C. on the GaAs substrate 1 to grow a ZnO buffer layer 21 with a growth thickness of 15 nm.
[0036] (3) An AlN buffer layer 22 is grown on the ZnO buffer layer 21 at a temperature of 700° and a growth thickness of 15 nm.
[0037] (4) A U1-type GaN layer 31 is grown on the AlN buffer layer 22 , and the temperature is adjusted to 1100° C. to grow the U1-type GaN layer 31 for about 30 minutes with a thickness of 3 μm.
[0038] (5) Superlattice GaN / AlGaN Bragg reflective layer 33 is grown on U1-type GaN layer 31 with a cycle number of 5, in which the thickness of GaN is 2nm, the thickness of AlGaN is 2nm, the growth temperature is 1100 degrees, and the Al composition of AlGaN is 0.3.
[0039] (6) A U2-type GaN layer 32 is grown on the superlattice GaN / AlGaN Brag...
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