Circuit board structure and manufacturing method thereof
A production method and circuit board technology, which is applied in the fields of printed circuit manufacturing, printed circuit, printed circuit components, etc., can solve problems such as functional failure, network relationship change, copper leakage, etc., and achieve the effect of good functionality
Active Publication Date: 2019-06-11
QING DING PRECISION ELECTRONICS HUAIAN CO LTD +2
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Problems solved by technology
In the prior art, in order to achieve gold plating on flexible circuit boards, it is necessary to pre-design the electroplating leads during the design of the production process to ensure that all joints form a circuit with the external electrodes and realize gold adhesion at the joints. In the subsequent process, die-cutting is also required. Or cut the circuit leads by machine drilling to restore the original circuit network relationship of the flexible circuit board, the process is cumbersome and the cost is high
In addition, after the electroplating lead is cut by die-cutting or machine drilling, copper leakage will occur on the side cut surface of the product. This copper leakage will cause a bad short circuit between the flexible circuit board and other components, causing changes in the network relationship and resulting in functional failure.
Method used
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Embodiment Construction
[0024] The manufacturing method of the circuit board structure of the preferred embodiment of the present invention comprises the following steps:
[0025] For a first step, see figure 1 , providing a substrate 1 . The substrate 1 includes a first base layer 11 , a first conductive layer 12 and a second conductive layer 13 . The first base layer 11 includes a first surface 111 and a second surface 112 opposite to the first surface 111, the first conductive layer 12 is disposed on the first surface 111, and the second conductive layer 13 is disposed on the first surface 111. on the second surface 112 . The first base layer 11 is a flexible resin layer, such as polyimide (Polyimide, PI), polyethylene terephthalate (Polyethylene Terephthalate, PET) or polyethylene naphthalate (Polythylene Naphthalate, PEN ). In this embodiment, both the first conductive layer 12 and the second conductive layer 13 are copper foil.
[0026] In the second step, see figure 2 , making the first...
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The invention provides a circuit board structure comprising a first substrate layer, a first circuit layer, a second circuit layer, a second protection layer formed at the outer side of the second circuit layer, and a coverage structure arranged on the second protection layer. The first circuit layer and the second circuit layer are arranged at the two opposite surfaces of the first substrate layer. The second circuit layer includes a junction flat cable; the second protection layer covers the second circuit layer and exposes the junction flat cable; and the coverage structure and the junction flat cable are connected. In addition, the invention also relates a manufacturing method of the circuit board structure.
Description
technical field [0001] The invention relates to the field of circuit boards, in particular to a circuit board structure and a manufacturing method thereof. Background technique [0002] Flexible circuit boards are widely used in important modules of smart phones, tablet computers and other products due to their advantages such as light weight, thin thickness, high circuit density, bendability, and bendability. In order to ensure a good bonding effect between the flexible circuit board product and other components in the product and a stable working environment, the industry conducts gold-plated treatment on the copper surface of the flexible circuit board product that needs to be connected with other components to ensure good conductivity of the joint part. commonality and reliability. In the prior art, in order to achieve gold plating on flexible circuit boards, it is necessary to pre-design the electroplating leads during the design of the production process to ensure tha...
Claims
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IPC IPC(8): H05K1/02H05K1/11H05K3/00
CPCH05K1/0296H05K1/117H05K3/0097H05K2203/1377
Inventor 田明
Owner QING DING PRECISION ELECTRONICS HUAIAN CO LTD