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Printed circuit board manufacturing method, printed circuit board and mobile terminal

A technology of printed circuit boards and metal sheets, which is applied in the field of electronics and can solve problems such as circuit breakage in the board

Inactive Publication Date: 2017-05-24
VIVO MOBILE COMM CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] Embodiments of the present invention provide a method for manufacturing a printed circuit board, a printed circuit board, and a mobile terminal, so as to solve the problem that the printed circuit board is constantly impacted by external forces, and the circuit breakage in the board is prone to occur at positions where the strength is weak or the stress is concentrated The problem

Method used

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  • Printed circuit board manufacturing method, printed circuit board and mobile terminal
  • Printed circuit board manufacturing method, printed circuit board and mobile terminal
  • Printed circuit board manufacturing method, printed circuit board and mobile terminal

Examples

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Effect test

no. 1 example

[0032] refer to Figure 1A , which shows one of the flowcharts of a method for manufacturing a printed circuit board according to the first embodiment of the present invention, which may specifically include the following steps:

[0033] Step 101, making a pad in a predetermined area of ​​the printed circuit board;

[0034] A printed circuit board (PCB) is a support for electronic components and a carrier for electrical connections of electronic components. Almost all electronic equipment includes printed circuit boards.

[0035] In the embodiment of the present invention, the printed circuit board can be applied to a mobile terminal, and the mobile terminal can be an electronic device such as a mobile phone or a tablet computer, or an electronic device such as a smart watch or a smart bracelet. The embodiment of the present invention does not limit the specific type of the mobile terminal.

[0036] In the embodiment of the present invention, when fabricating a printed circu...

no. 2 example

[0060] refer to figure 2 , which shows a flow chart of a method for manufacturing a printed circuit board according to the second embodiment of the present invention. The printed circuit board is applied to a mobile terminal, and may specifically include the following steps:

[0061] Step 201, making a pad in a predetermined area of ​​the printed circuit board;

[0062] In the embodiment of the present invention, when fabricating a printed circuit board applied to a mobile terminal, a pad may be firstly fabricated on a predetermined area of ​​the printed circuit substrate. The printed circuit board substrate may refer to a semi-finished PCB board that has not completed the production process of all printed circuit boards, and the preset area may refer to an area of ​​weak strength or stress concentration in the printed circuit board, for example, it may be It is an area that is often impacted by external force when it is mounted on a mobile terminal such as a mobile phone. ...

no. 3 example

[0081] refer to Figure 4 , shows a cross-sectional view of a printed circuit board according to a third embodiment of the present invention, and the printed circuit board 400 may specifically include:

[0082] printed circuit board substrate 401;

[0083] A pad 402 fabricated in a predetermined area of ​​the printed circuit board substrate 401;

[0084] A metal sheet 403 of a specific shape is mounted on the pad 402;

[0085] In a specific implementation, the preset area may refer to an area of ​​weak strength or concentrated stress in the printed circuit board, for example, an area that is often impacted by external force when assembled on a mobile terminal such as a mobile phone. Further, the pads made in the preset area can have a suitable shape corresponding to the preset area. For example, the shape of the pads can be based on the range of the stress concentration area simulated by the simulation software and the space around the printed circuit board. The specific si...

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PUM

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Abstract

The embodiment of the invention provides a printed circuit board manufacturing method, a printed circuit board and a mobile terminal. The method comprises steps: a pad is manufactured in a preset area of the printed circuit substrate; and a metal sheet manufactured in advance and in a specific shape is mounted on the pad, and thus, the printed circuit board is formed. The step of manufacturing the metal sheet in a specific shape comprises the following sub steps: in view of the preset area, a quadrilateral area covering the preset area is generated; the length of a diagonal line of the quadrilateral area is determined; according to the length of the diagonal line, the target diagonal line length is calculated; and by adopting the target diagonal line length, a metal sheet covering the preset area is manufactured, as the preset area is generally an area with weak strength or concentrated stress, after the metal sheet is mounted on the preset area, the anti-external force ability of the area can be enhanced, and the purpose of reducing the risk that the line in the area is broken can be achieved.

Description

technical field [0001] The embodiments of the present invention relate to the field of electronic technology, and in particular to a method for manufacturing a printed circuit board, a printed circuit board, and a mobile terminal. Background technique [0002] With the advancement of technology, mobile terminals such as mobile phones and tablet computers have increasingly become an indispensable part of people's work and life. Take mobile phones as an example. At present, mobile phones have more and more functions, and people can complete a series of activities such as reading, searching, purchasing and payment on mobile phones. [0003] The functions of mobile phones are all realized by electronic components. The PCB (Printed Circuit Board, printed circuit board) board assembled in the mobile phone realizes the electrical connection between various electronic components through the surface and internal interconnection lines, and is the carrier of all electronic components. ...

Claims

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Application Information

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IPC IPC(8): H05K3/30
CPCH05K3/303H05K2201/2009
Inventor 孟建华
Owner VIVO MOBILE COMM CO LTD
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