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Method and mold for producing ultra-thick chopping board

A cutting board and ultra-thick technology, applied in the direction of coating, etc., can solve the problems of affecting the appearance effect, heavy manual workload, and high overall cost, and achieve the effects of shortening the molding cycle, improving production efficiency, and saving costs

Pending Publication Date: 2017-05-31
通达创智(厦门)股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] The traditional oil pressure process can also form cutting boards with a thickness of 8-50mm, but this process has a long forming cycle, which is about 20-30 minutes for a single piece of molding. The manual workload is large, and the stress marks on the surface are very obvious due to uneven cooling. Processing chamfering and trimming affect the appearance, and the overall cost is high

Method used

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  • Method and mold for producing ultra-thick chopping board
  • Method and mold for producing ultra-thick chopping board
  • Method and mold for producing ultra-thick chopping board

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Embodiment Construction

[0045] The following is a method for producing ultra-thick cutting boards as the best embodiment of the present invention, which includes the following steps in turn: insert molding, insert sandwich injection molding, taking out and trimming, and packaging the finished product;

[0046] Insert molding: pass the first material through the extrusion process to obtain the required insert;

[0047] Insert sandwich injection molding: place the insert in the cavity of the mold of the vertical injection molding machine in the center, and through injection molding, the outer surface of the insert is covered with a layer of second material to obtain an ultra-thick cutting board;

[0048] Taking out and trimming: Take out the formed ultra-thick cutting board, cut off the gate to get the finished product;

[0049] Packaging the finished product: Pack the finished product and put it in the packing box.

[0050] Further, insert sandwich injection molding includes the following steps:

[...

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Abstract

The invention provides a method for producing an ultra-thick chopping board. The method sequentially comprises the following steps of insert forming, insert sandwich injection molding, taking-out and trimming, and finished product packaging. A mold for producing the ultra-thick chopping board comprises a fixed mold, a movable mold and an insert, wherein the fixed mold and the movable mold are arranged oppositely in the vertical direction. The fixed mold comprises a fixed mold plate and a first ejection mechanism, and the first ejection mechanism is arranged on the fixed mold plate. The movable mold comprises a movable mold plate and a second ejection mechanism. The second ejection mechanism is arranged on the movable mold plate. The fixed mold plate and the movable mold plate are assembled with each other to form a mold cavity. The insert is placed in the middle of the mold cavity. By the adoption of the method and mold for producing the ultra-thick chopping board, insert sandwich injection molding for producing the ultra-thick chopping board is achieved, the machining technique is optimized, the machining cost is reduced, and the production efficiency is improved.

Description

technical field [0001] The invention relates to the technical field of cutting board production, in particular to a production method and mold for an ultra-thick cutting board with a thickness of 8-50 mm. Background technique [0002] In the prior art, the technology of producing chopping board has following three kinds: [0003] 1. The traditional injection molding process for the production of cutting boards (below 8mm) is as follows: the total molding cycle of the injection molding machine is about 120s → the excess nozzle is manually repaired with a knife, and then refined with a jig → the first pressing plate is cooled and shaped Flatness: single dish The plate is under the cylinder pressure of 8 kg, the platen temperature is controlled at 50 degrees, and the cooling cycle is controlled at 472s→the second platen cooling and shaping flatness: multiple cutting boards are under the cylinder pressure of 8 kg, and the platen temperature is normal, the cooling cycle is contro...

Claims

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Application Information

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IPC IPC(8): B29C45/14B29C45/17B29C45/40B29C45/26
CPCB29C45/14008B29C45/1418B29C45/26B29C45/2608B29C45/4005B29C2045/14245
Inventor 骆杰涂鸿清
Owner 通达创智(厦门)股份有限公司
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