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Radiation window based on semiconductor refrigeration and heating

A cooling, heating and semiconductor technology, applied in windows and radiant windows, can solve the problems of excessive temperature difference and low efficiency, and achieve the effects of rapid heating response, stable operation and simplified structure

Inactive Publication Date: 2017-05-31
TSINGHUA UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

The invention can solve the problem of low efficiency caused by excessive temperature difference during the operation of the semiconductor component, simplifies the structure of

Method used

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  • Radiation window based on semiconductor refrigeration and heating
  • Radiation window based on semiconductor refrigeration and heating

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Embodiment Construction

[0014] The present invention will be described in detail below in conjunction with the accompanying drawings.

[0015] figure 1 A structural diagram of a radiant window based on semiconductor refrigeration and heating provided by the present invention, the radiant window includes a window outer layer 2a and a window inner layer 2b, and a plurality of semiconductors are arranged between the window outer layer 2a and the window inner layer 2b Component 1, each semiconductor component 1 includes a PN node 4, an outer metal conductor 5a and an inner metal conductor 5b; the radiation window structure is the window outer layer 2a, the outer metal conductor 5a, the PN node 4, and the inner metal conductor from outside to inside. 5b and window inner layer 2b. The contact between the window outer layer 2a, the outer metal conductor 5a, the PN node 4, the inner metal conductor 5b and the window inner layer 2b is coated with heat-conducting silicone grease or installed with a heat-condu...

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Abstract

Provided is a radiation window based on semiconductor refrigeration and heating. The radiation window comprises a window outer layer, a window inner layer and multiple semiconductor assemblies arranged between the window outer layer and the window inner layer; each the semiconductor assembly comprises a power line, a metallic conductor and a PN junction, and the PN junction is directly connected to the window layers through the metallic conductor, and connected to the power line through the metallic conductor. Through the radiation window based on semiconductor refrigeration and heating, temperature lowering or temperature increasing is fast conducted on a window inner surface by the use of a semiconductor refrigeration and heating theory, there is no need to use a draught fan, and system energy consumption and noise are effectively reduced; intermittent radiation refrigeration and heating are achieved, and a thermal environment with high comfort level is fostered; meanwhile the radiation window is simple in structure, stable in operation and high in safety, can be arranged personalizedly, and is high in aesthetic property.

Description

technical field [0001] The invention relates to a window, in particular to a radiation window based on semiconductor refrigeration and heating, and belongs to the technical field of building components. Background technique [0002] As an integral part of the building, windows have the characteristics of strong light transmission and high heat transfer coefficient, but this greatly increases the air conditioning and heating load of the building. Therefore, how to improve the thermal performance of windows under the premise of ensuring the lighting requirements is the focus of research. In the prior art, windows are mainly composed of low-e glass, vacuum glass and the like. Low-e glass can reduce the solar radiation entering the room through the window, thereby reducing the cooling load of the room; vacuum glass can increase the heat transfer coefficient of the window, improve the thermal insulation performance of the window, and reduce the cooling and heating load of the ro...

Claims

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Application Information

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IPC IPC(8): E06B7/28F25B21/04
CPCE06B7/28F25B21/04
Inventor 林波荣孙弘历
Owner TSINGHUA UNIV