Method for measuring micro deformation of structures under thermal vacuum high-and-low-temperature environments

Abstract

The invention discloses a method for measuring the micro deformation of structures under thermal vacuum high-and-low-temperature environments. According to the method, a measuring subsystem, a temperature control subsystem and a structural support subsystem are adopted; a tested structure is subjected to speckle spraying, and then, the tested structure is installed on the supporting device of a vacuum tank, and corresponding target points and temperature sensors are attached onto the tested structure; after preparation work is completed, the vacuum tank is sealed and vacuumized; liquid nitrogen supply and a heater are adjusted, so that internal ambient temperature can be adjusted; after a target temperature condition appears, a motor is adopted to control and adjust the positions of cameras, so that images can be obtained; after experimental data acquisition is completed, software is utilized to perform correlation calculation and rigid displacement removal; and the deformation of the tested structure is finally obtained. The method of the invention provides good hardware and software system support for the high-precision measurement of the thermal deformation of the structure and can carry out in-situ high-precision thermal deformation measurement under wide-temperature range vacuum conditions.

Description

technical field [0001] The invention relates to a method for measuring structural micro-deformation. Background technique [0002] The method for measuring micro-deformation of structures in a vacuum high-low temperature environment mainly solves the problem of in-situ high-precision real-time measurement of the micro-deformation of a three-dimensional field of a high-stability structure in a vacuum high-low temperature environment. [0003] At present, the methods for measuring structural micro-deformation in vacuum high and low temperature environments mainly include external measurement methods separated by optical glass and photogrammetry methods in in-situ environments. Since high-precision measuring instruments are mainly composed of precision devices, measurement work is generally carried out in a laboratory environment with constant temperature and humidity or in a normal temperature and pressure environment. Therefore, the measuring instrument is placed outside the...

AI Technical Summary

Problems solved by technology

[0008] The technical problem solved by the present invention is: to overcome the deficiencies of the prior art, to provide a method for measuring structural micro-deformation in a thermal vacuum high and low temperature environment, to solve the problems of precision instrument protection and three-dimensional field measurement, and to effectively carry out measurement data related to digital speckle images. Fusion to avoid distortion of measurement data caused by low air pressure and alternating high and low temperatures

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