Quality inspection method of copper plating on flexible circuit board of camera module

A technology of flexible circuit boards and camera modules, which is applied in the direction of chemical analysis by titration, which can solve the problems of detection quality and achieve good detection results

Inactive Publication Date: 2020-02-25
芜湖赋兴光电有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

The camera module needs a flexible circuit board. The flexible circuit board needs to be drilled during the production process, and then copper is deposited in the drilled hole. At present, it is very important for the quality of the copper plating of the flexible circuit board. It is necessary to test the quality. At present, there is no special method for testing the quality in production, so it is very important to solve the above problems.

Method used

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Embodiment Construction

[0018] In order to deepen the understanding of the present invention, the present invention will be further described below in conjunction with examples, which are only used to explain the present invention and do not constitute a limitation to the protection scope of the present invention.

[0019] This embodiment provides a method for detecting the quality of copper plating on a flexible circuit board of a camera module, including the following steps:

[0020] Step 1: Take back the flexible circuit board after copper plating, and then dry it;

[0021] Step 2: Cut the flexible circuit board dried in step 1 into 2*2cm;

[0022] Step 3: Put a 2*2cm flexible circuit board into a 250ml transparent glass, add 25ml buffer solution to cover the flexible circuit board;

[0023] Step 4: Add 2-3 drops of hydrogen peroxide to the transparent glass in Step 3;

[0024] Step 5: Stir to dissolve all the sinking copper;

[0025] Step 6: Add 60-70ml of ethanol after all dissolved;

[0026...

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Abstract

The purpose of the invention is to provide a method for detecting the quality of deposition plated copper on a camera module flexible circuit board. The method comprises the following steps: cutting a copper deposited and plated flexible circuit board to form a 2*2 cm flexible circuit board, adding the 2*2 cm flexible circuit board to a buffering solution, adding hydrogen peroxide, stirring the 2*2 cm flexible circuit board and the solution to dissolve the 2*2 cm flexible circuit board, adding ethanol, adding a PAN indicator, adopting EDTA to carry out titration, calculating the use amount of the EDTA, and obtaining the quality index according to the use amount of the EDTA. The method can be used to well detect the quality of the deposition plated copper, and is suitable for being used in production.

Description

technical field [0001] The invention relates to the field of processing flexible circuit boards of camera modules, in particular to a method for detecting the quality of copper plating on flexible circuit boards of camera modules. Background technique [0002] With the continuous improvement of technology, taking pictures has become a function that people often use in daily life, so the development of cameras is very important. The camera module needs a flexible circuit board. The flexible circuit board needs to be drilled during the production process, and then copper is deposited in the drilled hole. At present, it is very important for the quality of the copper plating of the flexible circuit board. It is necessary to test the quality, and there is no special method for testing the quality in production at present, so it is very important to solve the above problems. Contents of the invention [0003] In order to solve the above problems, the present invention provides...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G01N31/16
CPCG01N31/16
Inventor 徐冯光黄师平刘永发
Owner 芜湖赋兴光电有限公司
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