Position correction device and position correction method

Abstract

The invention discloses a position correction device and a position correction method. The position correction device and method are used for correcting a substrate to a designated position, and the position correction device includes a first correction group and a second correction group. The first correction group includes a first correction unit containing a first elastic part, the second correction group includes a second correction unit containing a second elastic part, and the elastic coefficient of the second elastic part is less than that of the first elastic part; when the device is used, the first correction group is driven to move to a first preset position in a first direction, then the second correction group is driven to move to a second preset position in a second direction, the first direction is opposite to the second direction, and the substrate is clamped between the first correction group and the second correction group. According to the device and method, the elastic coefficient of the preferentially actuated correction group is greater, the accuracy and the stability of correction are ensured, the elastic coefficient of the later actuated correction group is smaller, a gentle logistic curve of an applied force exerted on the substrate is ensured, and the risk that the substrate generates cracks is reduced.

Description

Technical field [0001] The invention relates to a position correction device and a position correction method, in particular to a position correction device and a position correction method for correcting the placement position of a display panel and preventing cracks and even fragments of the display panel during the correction process. Background technique [0002] The liquid crystal display device has many advantages such as thin body, power saving, and no radiation, and has been widely used. When manufacturing a liquid crystal display device, electrical microstructures need to be formed on the surface of the glass substrate. In order to ensure that the electrical microstructures are formed in the correct position, the glass substrate needs to be placed at a designated position on the operating table. In actual operation, the glass substrate may not be accurately placed at the above-mentioned designated position when it is placed on the operating table, so the position of the ...

AI Technical Summary

Problems solved by technology

Generally, the critical value of breaking the edge of the glass substrate is about 100Mpa, if the first correction group 1100' and / or the second correction group 1200' correct the If the impact force is too large, it may cause cracks in the substrate 2000', increasing the risk of the substrate 2000' being broken during the subsequent process.

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