Automatic silicon slice separating device
An automatic separation and driving device technology, which is applied in the manufacture of electrical components, circuits, semiconductors/solid-state devices, etc., can solve the problem of overlapping multiple silicon chips, achieve rapid separation, improve work efficiency, and increase production costs.
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[0019] Such as Figure 1-5 As shown, a silicon wafer automatic separation device includes a frame 1, a control unit 2 and a laser ranging sensor 3. The frame 1 is provided with a ring support 4 for rotation, and the frame 1 is provided for driving The first driving device 5 for the rotation of the ring support 4, the ring support 4 is provided with four groups of first conveyor belts 6 distributed along the circumference, the ring support 4 is provided with grooves, and the first conveyor belt 6 is arranged in the concave In the groove, the first conveyor belt 6 is provided with a driven friction wheel 7, and the frame 1 is provided with two sets of first driving friction wheels 10, and a second driving friction wheel 10 is provided between the first driving friction wheels 10 The friction wheel 11, the rotation direction of the first driving friction wheel 10 and the second driving friction wheel 11 are opposite, the first driving friction wheel 10 and the seco...
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