Electrostatic chuck separation device
An electrostatic chuck and separation device technology, which is applied in the manufacture of circuits, electrical components, semiconductor/solid-state devices, etc., can solve the problems of damage to the electrostatic chuck, time-consuming and laborious, inconvenient operation, etc., and achieves good structural rigidity and easy manufacturing. , the effect of reducing resistance
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[0025] In the present invention, the "height" refers to the vertical distance between the heating sheet and the rail seat.
[0026] Adhesive technologies are widely used in semiconductor processing and manufacturing processes, such as chip packaging, wafer stacking, and the connection of functional components of electrostatic chuck 6. The so-called bonding is to connect at least two components together through an adhesive. In the processing equipment, the PVD, CVD, Etch and other process equipment are equipped with an electrostatic chuck assembly. The electrostatic chuck assembly includes an electrostatic chuck 6 and a chuck base 5. The electrostatic chuck 6 is bonded to the chuck through an adhesive layer Base 5.
[0027] In the course of long-term use, the adsorption force of the electrostatic chuck 6 will decrease, and the electrostatic chuck 6 needs to be repaired or replaced. First, the electrostatic chuck 6 needs to be separated from the chuck base 5 and then processed In or...
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